XCede® HD Plus

Overview

Click Image to Enlarge

Overview

Description
Read More
Features & Benefits
FEATURES BENEFITS
  • Data rates capable up to 28 Gb/s to support system upgrades without costly redesigns
  • Backwards mating compatible with XCede®HD connector
  • Compliance with the Hard Metric form factor requirements outlined in EN 61076-4-101:2001
  • Highest density with 1.8mm pitch
  • 42 to 84 differential pairs per inch (16 to 33 differential pairs per centimeter)
  • Meets the high density needs of today's challenging architectures
  • Embedded capacitor available
  • For additional performance margin and overall system cost savings
  • Leverages on application specific derivatives, including coplanar and orthogonal configurations
  • Provides a complete solution for customer's unique requirements
  • Meets standards, such as the IEEE 802.3bj
  • Provides designers with the flexibility to design systems with an easy upgrade path to 56 Gb/s PAM4 performance
  • Added metal shield tied to ground system with conductive posts
  • Reduces crosstalk
  • Modified mating beams vs. previous XCede®HD versions to move resonance past 25GHz
  • Moves resonance past 25GHz
  • Miniaturized compliant pins
  • Improves impedance matching and enables deeper backdrilling
  • XCede®HD Plus backplane sidewall strength is 2X the strength of other popular backplane connectors
  • Stands out among competition in terms of durability
  • Three levels of contact sequencing
  • Enables hot plugging

Part Numbers

Target Markets & Applications