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Overview

Overview

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Description
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Features & Benefits
FEATURES BENEFITS
  • A 15.7mil drill compliant pin allows deeper back drilling
  • Dual diameter vias enhance the return loss performance of the footprints
  • Optimized daughter-card and backplane footprints each have two ground vias between differential pairs
  • Allows elongated antipads that further improve impedance
  • Guidance and keying options
  • Support the widest set of customer applications
  • Backplane modules feature wide rib-enhanced shield contacts
  • Provides mechanical longevity and ruggedness
  • Provides a combination of low cross-talk, best-in-class linearity, low mode conversion and unrivaled footprint performance
  • Delivers solid and proven 56Gb/s performance in real systems
  • Data rates capable up to 56 Gb/s to support system upgrades without costly redesigns
  • Backward mating compatible with XCede® connector
  • Up to 82 differential pairs per linear inch
  • Meets the high-density needs of today's challenging architectures
  • Embedded capacitor available
  • For additional performance margin and overall system cost savings
  • Leverages on application-specific derivatives, including coplanar and orthogonal configurations
  • Provides a complete solution for customer's unique requirements
  • Meets standards, such as the IEEE 802.3
  • Provides designers with the flexibility to design systems with an easy upgrade path to 56 Gb/s PAM4 performance
  • Added metal shield tied to a ground system with conductive posts
  • Reduces crosstalk
Target Market / Application
Communications
  • Hubs
  • Switches
  • Router
  • Optical Transport
  • Wireless Infrastructure
Data
  • Server
  • External Storage System
  • Supercomputer
Industrial & Instrumentation
  • Test Equipment
  • Emulation Equipment
Documentation
Configure Your Product

Configure Your Product

Configure your Amphenol ICC product by using our Part Configurator below. To download a 3D model, 2D drawing or to generate a datasheet, please login.

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Part Numbers

Part Numbers

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Column Pitch
  1. 1.85mm 10 items
Data Rate
  1. 56Gbps 10 items
Gender
  1. Header 10 items
Housing Style
  1. Guide 2 items
  2. Open 5 items
  3. Wall 3 items
Number of Columns
  1. 4 1 item
  2. 6 5 items
  3. 8 4 items
Number of Differential pairs per Column
  1. 4 5 items
  2. 5 5 items
Orientation
  1. Vertical 10 items
Plating Contact area
  1. APP 10 items
Product Type
  1. X2 10 items
Total Differential Pair
  1. 20 1 item
  2. 24 4 items
  3. 30 1 item
  4. 32 1 item
  5. 40 3 items
Wipe (Contact)
  1. 2mm Sig, 3.5mm GND 5 items
  2. 2mm Sig, 4mm GND 3 items
  3. 3mm Sig, 4mm GND 2 items
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Part Number Description Product Drawing Status
974-400B-C0H
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Xcede® , High speed backplane connectors , x2 bp , 4-pair , open.

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974-400C-L0H
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Xcede® , High speed backplane connectors , x2 bp , 4-pair , 8 position , open.

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974-4A0B-C0H
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Xcede® , High speed backplane connectors , x2 bp , 4-pair , left polarizing

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974-4B0B-C0H
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Xcede® , High speed backplane connectors , x2 bp , 4-pair , left polarizing

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974-500C-A0H
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Xcede® , High speed backplane connectors , x2 bp , 5-pair , 8 position , open.

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974-5L0C-A0H
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Xcede® , High speed backplane connectors , x2 bp , 5-pair , 8 position , Left Wall.

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974-5M0A-A0H
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Xcede® , High speed backplane connectors , x2 bp , 5-pair , Right Wall.

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974-5M0C-A0H
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Xcede® , High speed backplane connectors , x2 bp , 5-pair , 8 position , Right Wall.

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974401BL0H
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Xcede® , High speed backplane connectors , x2 bp , 4-pair , 6 position , open.

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974500BA0H
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Xcede® , High speed backplane connectors , x2 bp , 5-pair , open.

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Test Report

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