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Overview

Overview

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Description
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Features & Benefits
FEATURES BENEFITS
  • A 15.7mil drill compliant pin allows deeper back drilling
  • Dual diameter vias enhance the return loss performance of the footprints
  • Optimized daughter-card and backplane footprints each have two ground vias between differential pairs
  • Allows elongated antipads that further improve impedance
  • Guidance and keying options
  • Support the widest set of customer applications
  • Backplane modules feature wide rib-enhanced shield contacts
  • Provides mechanical longevity and ruggedness
  • Provides a combination of low cross-talk, best-in-class linearity, low mode conversion and unrivaled footprint performance
  • Delivers solid and proven 56Gb/s performance in real systems
  • Data rates capable up to 56 Gb/s to support system upgrades without costly redesigns
  • Backward mating compatible with XCede® connector
  • Up to 82 differential pairs per linear inch
  • Meets the high-density needs of today's challenging architectures
  • Embedded capacitor available
  • For additional performance margin and overall system cost savings
  • Leverages on application-specific derivatives, including coplanar and orthogonal configurations
  • Provides a complete solution for customer's unique requirements
  • Meets standards, such as the IEEE 802.3
  • Provides designers with the flexibility to design systems with an easy upgrade path to 56 Gb/s PAM4 performance
  • Added metal shield tied to a ground system with conductive posts
  • Reduces crosstalk
Target Market / Application
Communications
  • Hubs
  • Switches
  • Router
  • Optical Transport
  • Wireless Infrastructure
Data
  • Server
  • External Storage System
  • Supercomputer
Industrial & Instrumentation
  • Test Equipment
  • Emulation Equipment
Documentation
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Test Report

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