X2

Overview

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FEATURES	BENEFITS
A 15.7mil drill compliant pin allows deeper back drilling	Dual diameter vias enhance the return loss performance of the footprints
Optimized daughter-card and backplane footprints each have two ground vias between differential pairs	Allows elongated antipads that further improve impedance
Guidance and keying options	Support the widest set of customer applications
Backplane modules feature wide rib-enhanced shield contacts	Provides mechanical longevity and ruggedness
Provides a combination of low cross-talk, best-in-class linearity, low mode conversion and unrivaled footprint performance	Delivers solid and proven 56Gb/s performance in real systems
Data rates capable up to 56 Gb/s to support system upgrades without costly redesigns	Backward mating compatible with XCede^® connector
Up to 82 differential pairs per linear inch	Meets the high-density needs of today's challenging architectures
Embedded capacitor available	For additional performance margin and overall system cost savings
Leverages on application-specific derivatives, including coplanar and orthogonal configurations	Provides a complete solution for customer's unique requirements
Meets standards, such as the IEEE 802.3	Provides designers with the flexibility to design systems with an easy upgrade path to 56 Gb/s PAM4 performance
Added metal shield tied to a ground system with conductive posts	Reduces crosstalk