Toggle Nav
Search
Advanced Search
Contact Us
Language
English EN
Sample Cart 0

Get your sample by choosing part number(s) from the product page or using the search box above.

background-body

Menu

X2

X2

REQUEST FOR QUOTE Share Print
Overview
Configure Your Product
Part Numbers
Test Report
Overview

Overview

Loading...
Click Image to Enlarge
Description
Read More
Features & Benefits
FEATURES BENEFITS
  • A 15.7mil drill compliant pin allows deeper back drilling
  • Dual diameter vias enhance the return loss performance of the footprints
  • Optimized daughter-card and backplane footprints each have two ground vias between differential pairs
  • Allows elongated antipads that further improve impedance
  • Guidance and keying options
  • Support the widest set of customer applications
  • Backplane modules feature wide rib-enhanced shield contacts
  • Provides mechanical longevity and ruggedness
  • Provides a combination of low cross-talk, best-in-class linearity, low mode conversion and unrivaled footprint performance
  • Delivers solid and proven 56Gb/s performance in real systems
  • Data rates capable up to 56 Gb/s to support system upgrades without costly redesigns
  • Backward mating compatible with XCede® connector
  • Up to 82 differential pairs per linear inch
  • Meets the high-density needs of today's challenging architectures
  • Embedded capacitor available
  • For additional performance margin and overall system cost savings
  • Leverages on application-specific derivatives, including coplanar and orthogonal configurations
  • Provides a complete solution for customer's unique requirements
  • Meets standards, such as the IEEE 802.3
  • Provides designers with the flexibility to design systems with an easy upgrade path to 56 Gb/s PAM4 performance
  • Added metal shield tied to a ground system with conductive posts
  • Reduces crosstalk
Target Market / Application
Communications
  • Hubs
  • Switches
  • Router
  • Optical Transport
  • Wireless Infrastructure
Data
  • Server
  • External Storage System
  • Supercomputer
Industrial & Instrumentation
  • Test Equipment
  • Emulation Equipment
Documentation
Documentation
Configure Your Product

Configure Your Product

Configure your Amphenol ICC product by using our Part Configurator below. To download the 3D model and 2D drawing and to generate a datasheet, please login.

Configure product not available for this product series.

Part Numbers

Part Numbers

Part Number Coming Soon.
Test Report

Test Report

Kindly contact Amphenol ICC for test report.

Contact Us