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VHDM<sup>®</sup>
Overview
Overview
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Description
Features & Benefits
Features
- Available in 6 Row and 8 Row
- 2 x 2.25 mm grid
- 76-101 real signals per linear inch
- VHDM® backplane module available in 10 position and 25 position
- Modular design allows for single ended (VHDM®) and differential (VHDM-HSD™) wafers to be placed on the same stainless steel rear organizer (stiffener)
- Shared components (guides, powers, etc.) with VHDM-HSD™
- Open pin field version (VHDM® L-Series wafer) can be used to reduce overall slot cost and is stiffener compatible with all other VHDM® wafer types
- Right Angle Male option available
- VHDM® Stacker provides a press-fit solution for stacking applications (available in 6 row)
Benefits
- Backward mate compatible derivatives allowing for cost effective upgrade paths
- Data rates up to 25 Gb/s
- Large array of wafer types that can be combined on one stiffener allows for design flexibility
- Vertically integrated supply chain using automated assembly equipment and full cavitation on component tooling allows for an optimized cost solution
Target Market / Application
Communications
- Telecom
- Wireless Base Station
Industrial & Instrumentation
- Test Equipment
Others
- Aerospace
Documentation
Documentation
- TB-2025 Process for Installation of R/A P/F VHDM Daughtercard Connectors
- TB-2026 Process for Installation of P/F VHDM Backplane Connectors
- TB-2043 R/A Male Daughtercard Connector Single Wafer Replacement
- TB-2047 Single Pin Replacement
- TB-2048 VHDM Backplane Signal Pin and Shield Replacement Procedure
- TB-2049 VHDM Backplane Shield Extraction Procedure
- TB-2072 VHDM Daughtercard Power Module Replacement Procedure
- TB-2074 Process for Installation of VHDM Backplane Power Module
- TB-2077 Workmanship Criteria for VHDM Daughtercard Connectors
- VHDM Module Configuration
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