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Overview

Overview

Features
  • Available in 5, 6 and 8 Row
  • 2 x 2.25 mm grid
  • 25-38 real signals per linear inch
  • VHDM-HSD™ backplane module available in 10 position and 25 position
  • Modular design allows for VHDM-HSD™ (differential) to be combined with VHDM® (single-ended) on the same stainless steel rear organizer (stiffener)
  • Shared components (guides, powers, etc.) with VHDM®
  • Embedded capacitor capability (5 Row eHSD®)
Benefits
  • Backward mate compatible derivatives allowing for cost effective upgrade paths
  • Data rates up to 25 Gb/s (eHSD® 5+)
  • Embedded capacitor capability (eHSD®5+)
  • Large array of wafer types that can be combined on one stiffener allows for design flexibility
  • Vertically integrated supply chain using automated assembly equipment and full cavitation on component tooling allows for an optimized cost solution
Target Market / Application
Communications
  • Telecom
  • Wireless Base Station
Others
  • Aerospace
Documentation

Documentation

Documentation Coming Soon.

Configure Your Product

Configure Your Product

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Part Numbers

Part Numbers

Part Number Coming Soon.
Test Report

Test Report

Kindly contact Amphenol ICC for test report.

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