USB 3.1 GEN 1

Overview

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Overview

Documentation
Documentation
Description
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Features & Benefits
FEATURES BENEFITS
  • Available in different height options
  • Customer design flexibility
  • Optional terminal DIP length
  • Suitable for different PCB thickness
  • High reliable terminal design
  • Superior electrical performance for low contact resistance
  • SuperSpeed up to 5Gb/s transmission
  • High performance in Signal Integrity (SI)
  • Optimized shell structure design
  • Full metal shielding for Electromagnetic Interference (EMI) / Radio-Frequency interference (RFI) /  Electromagnetic Discharge (ESD) protection
  • Rugged gold-plated leaf contact for reliability needs
  • Improves contact resistance and prevents corrosion
  • Halogen-free material
  • Meets environmental, health and safety requirements

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Target Markets & Applications