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Features & Benefits
  • 1.0 x 1.3 mm contact grid with 6 differential signal pairs per column
  • Provides high signal density: 25 pairs/cm2 (161 pairs/in2)
  • Shield-less design provides the lowest possible loss
  • Achieves similar SI performance with lesser weight and cost
  • Open pin field design with no designated grounds
  • Allows for differential, single-ended or power pin assignments in a connector
  • Capability to address a range of applications
  • Popular connector solution in the market
  • Array design
  • 200 to 800 contacts/connector
  • Stack heights from 12mm to 40mm
  • Meets a wide range of mezzanine applications
  • 2.0mm (nominal) wipe length and redundant split-beam contacts
  • For enhanced reliability
  • Integrated guidance with misalignment tolerance
  • Compensates for ±2.0mm misalignment in all directions
  • Optional power contacts
  • Allows flexibility in design
  • Proven Amphenol ICC FCI Ball Grid Array (BGA) technology
  • Enables reliable, SMT-compatible attachment
  • RoHS compliant (lead-free) options
  • Environmental friendly
Target Market / Application
  • Transmission
  • Access
  • Switching
  • Optics
  • Networking
  • Servers
  • Storage
Industrial & Instrumentation
  • Industrial controls
  • Analytical & diagnostic
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Test Report

Test Report

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