background-body

osfp

Overview

Overview

Click Image to Enlarge
Description
Read More
Features & Benefits
Features
  • 200Gb or 400Gb aggregate bandwidth capacity
  • Optimized PCB interface board with Auto Soldering process
  • 15 watt dissipative heat capacity
  • EEPROM in cable assembly
  • Enables 25Gb/ NRZ and 50Gb PAM4 per channel transmission
  • 32AWG-26AWG cable sizes
  • Passive copper length to 3 meters
  • Integrated heat sink and air flow channels as part of module design
  • Double ended as well as splitter cables
Benefits
  • Comprehensive system integrated interconnect design for copper or optical based cable solutions
  • Optimized signal integrity performance
  • Addresses current and future market desired bandwidth port capability requirements
  • Optimized heat dissipative and air-flow features to maximize the heat dissipative properties of the system
  • Meets signal performance requirements up to max. 3m length
  • Provides cost and performance-optimized solutions across multiple cable assembly lengths
  • Environmental friendly
  • Assures consistent cable performance
  • Adaptable to accommodate older legacy interfaces
Target Market / Application
Communications
  • Switches
  • Routers
  • Low latency communications systems
  • Network interface card (NICs)
  • Network Interface Cards
Data
  • Servers
  • Networked storage systems
  • External Storage Systems
  • High Performance Computing (APC) Applications
  • Data Center networking
Documentation
Documentation
Configure Your Product

Configure Your Product

Configure your Amphenol FCI product by using our Part Configurator below. To download the 3D model and 2D drawing and to generate a datasheet, please login.

Configure product not available for this product series.

Part Numbers

Part Numbers

Part Number Coming Soon.
Test Report

Test Report

Kindly contact Amphenol ICC for test report.

Contact Us