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micro-LinkOVER™ Above PCB Connector System

micro-LinkOVER™ Above PCB Connector System

Overview

Overview

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Description
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Features & Benefits
FEATURES BENEFITS
  • Utilizes Ardent's patented compression mount contacts
  • Performance up to 112G+ PAM4 per lane (demonstrated 100G baud per lane)
  • Signal-to-noise performance of >30dB of Insertion Loss to Crosstalk at 50 GHz
  • SKEWCLEAR® drainless parallel pair twinax
  • Eliminates complicated and lossy trace routing
  • Designed specifically for differential pairs/routing
  • High density footprint with 2.40mm pitch (cable)
  • Extremely short trace routing from IC to connector
  • Passive copper connector system
  • Lowers power requirements significantly compared to optical engines
Target Market / Application
Data
  • 100G/200G/400G Systems
  • 5G
  • Infiniband
  • PCIe
  • Data centers
  • Backside PCB interconnect
  • Backplanes
  • Future-proofing for 400G designs
  • Chip-to-Chip link
Documentation
Documentation
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