micro-LinkOVER™ Above PCB Connector System

Overview

Click Image to Enlarge

Overview

Documentation
Documentation
Description
Read More
Features & Benefits
FEATURES BENEFITS
  • Utilizes Ardent's patented compression mount contacts
  • Performance up to 112G+ PAM4 per lane (demonstrated 100G baud per lane)
  • Signal-to-noise performance of >30dB of Insertion Loss to Crosstalk at 50 GHz
  • SKEWCLEAR® drainless parallel pair twinax
  • Eliminates complicated and lossy trace routing
  • Designed specifically for differential pairs/routing
  • High density footprint with 2.40mm pitch (cable)
  • Extremely short trace routing from IC to connector
  • Passive copper connector system
  • Lowers power requirements significantly compared to optical engines

Target Markets & Applications