MEG-Array®

Overview

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Overview

Description
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Features & Benefits
FEATURES BENEFITS
  • High density, high speed, discrete contact, array connector in the revolutionary BGA platform
  • Legacy market-proven and trusted solution
  • Flexible ground distribution
  • Optimized for high-speed signal integrity 
  • 32Gb/s differential pair performance documented for 4mm and 6mm stack height
  • Scalable, high data rates
  • Online s-parameter files and signal integrity performance reports
  • Improves design accuracy and time-to-market
  • 1.27mm x 1.27mm grid provides 71 contacts per cm2 density
  • Saves space
  • Dual-point, long wipe contacts
  • Easy, reliable mating
  • Choice of six stack heights from 4mm to 14mm and choice of eight sizes from 81 to 528 positions
  • The wide range of sizes and PCB stack heights increase mechanical design flexibility 
  • High-density standard BGA attachment
  •  Lowers assembly costs by using standard SMT processes 
  • BGA features natural surface tension property
  •  Provides self-alignment and self-leveling for multiple connector usages 
  • Patented BGA contact attachment
  •  Preserves solder ball positioning 
  • Optimized PCB routing
  • Enhances electrical performance
  • Qualifies Telcordia GR-1217-CORE and NPS-25298-2 options 
  • Time-tested reliability record
  • 22+-year-old solder joint reliability per IPC-SM-785 
  •  Long-term reliability assurance from quality organizations
  • 17 Billion+ lines shipped
  • Has a long track record of customer satisfaction
  • Precious metal plating options
  • Satisfies varying customer needs for environmental resistance

Part Numbers

Target Markets & Applications