eHPCE® Enhanced High Power Card Edge Connector

Overview

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Overview

Description
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Features & Benefits
FEATURES BENEFITS
  • GCS® plating technology
  • Provides lower resistance
  • Current rating up to 48A per contact at 30°C temperature rise in still air
  • Higher performance with same mating footprint as classic HPCE®
  • 20% thicker contact material
  • 50% more points of contact
  • Enables 15% increase in power density
  • Enhanced housing design
  • Better mechanical alignment and increased robustness
  • Low-halogen housing
  • Meets JEDEC JS709 Electronic Industry Standard
  • Vertical, right angle and straddle mount configurations available
  • Suitable for a wide variety of application requirements
  • High temperature thermoplastic housing
  • Wide operating temperature from -55°C to 105°C

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