eHPCE^® Enhanced High Power Card Edge Connector

Overview

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FEATURES	BENEFITS
GCS^® plating technology	Provides lower resistance
Current rating up to 48A per contact at 30°C temperature rise in still air	Higher performance with same mating footprint as classic HPCE^®
20% thicker contact material 50% more points of contact	Enables 15% increase in power density
Enhanced housing design	Better mechanical alignment and increased robustness
Low-halogen housing	Meets JEDEC JS709 Electronic Industry Standard
Vertical, right angle and straddle mount configurations available	Suitable for a wide variety of application requirements
High temperature thermoplastic housing	Wide operating temperature from -55°C to 105°C