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cStack™ Flexible Circuit Assemblies

cStack™ Flexible Circuit Assemblies

Overview

Overview

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Description
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Features & Benefits
FEATURES BENEFITS
  • Three-dimensional interconnect
  • Enables unique packaging solutions not available with other technologies and can be routed over and around obstacles to conserve space and maximize airflow
  • Polyimide flex material
  • Lower signal loss and better temperature stability than FR4
  • cStack interposer employs compression termination which allows lower mated height
  • Lower mated height at 1.22mm offering superior performance
  • Multiple impedance values available
  • Can be optimized to meet a wide range of SI requirements
  • Thinner, lighter and of higher density than wired cables or rigid boards
  • Reduces space and weight
  • Multilayer construction with three or more copper layers
  • Optimizes routing, impedance and SI performance
Target Market / Application
Communications
  • Switches
  • Routers
  • Wireless Base Station
  • Base Station
  • Telecom
  • Datacom
  • Datacom/Networking Equipment
Data
  • Router and Server
  • Supercomputer
Industrial & Instrumentation
  • Test Equipment
  • Emulation Equipment
Medical
  • Imaging
  • Ultrasound Equipment
Military
  • Military Equipment
  • Radar Equipment
Others
  • Aerospace
Documentation
Documentation
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Configure Your Product

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Part Numbers

Part Numbers

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Part Number Description Product Drawing Status
9952-005
Status active
cStack Flex

cStack™ Flexible Circuit Assemblies, Mezzanine Connectors, cStack Flex, 6 x 5 (30 position).

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Test Report

Test Report

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