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cStack™ Flexible Circuit Assemblies

cStack™ Flexible Circuit Assemblies

Overview

Overview

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Description
Features & Benefits
FEATURES BENEFITS
  • Three-dimensional interconnect
  • Enable unique packaging solutions not available with other technologies
  • Can be routed over and around obstacles to conserve space and maximize airflow
  • Flexibility
  • Absorb large board to board tolerances
  • Use in static and dynamic flex applications
  • Signal Integrity
  • Polyimide flex material has lower signal loss and better temperature stability than FR-4
  • Multiple impedance values available
  • Can be optimized to meet a wide range of SI requirements
  • cStack interposer is 1.22 mm tall offering superior performance
  • Reduce space and weight
  • Thinner, lighter and higher density than wired cables or rigid boards
  • Compression termination
  • Low mated height
  • Reliable and rugged interconnect
  • Multilayer construction
  • Three or more copper layers available to optimize routing, impedance and SI performance
Target Market / Application
Communications
  • Switches
  • Routers
  • Wireless Base Station
  • Base Station
  • Telecom
  • Datacom
  • Datacom/Networking Equipment
Data
  • Router and Server
  • Supercomputer
Industrial & Instrumentation
  • Test Equipment
  • Emulation Equipment
Medical
  • Imaging
  • Ultrasound Equipment
Military
  • Military Equipment
  • Radar Equipment
Others
  • Aerospace
Documentation
Documentation

Documentation Coming Soon.

Configure Your Product

Configure Your Product

Configure your Amphenol FCI product by using our Part Configurator below. To download the 3D model and 2D drawing and to generate a datasheet, please login.

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Part Numbers

Part Numbers

Part Number Coming Soon.
Test Report

Test Report

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