Overview

Click Image to Enlarge

Overview

Documentation
Documentation

Documentation Coming Soon.

Description
Read More
Features & Benefits
FEATURES BENEFITS
  • Signal integrity data rates up to 25Gb/s with future technology roadmap upto 50+Gb/s
  • Excellent performance in a low profile footprint
  • Conventional connector material construction
  • Guarantees long-term connector performance, contact retention, and ruggedness
  • Solderless socket termination
  • Eliminates thermal stress of soldered socket products and allows field device upgrades
  • Patented contact retention
  • Positive contact retention
  • Positive housing stop during contact deflection
  • Allows for contact anti-overstress protection and superior shock and vibration performance
  • Custom and standard outer molded frames
  • Design flexibility for specific application requirements or utilize standard frames for cost effective solutions
  • Selectively loaded standard housings
  • Provides a custom footprint solution at a low tooling cost
  • Open pin field design provides for differential pair, single-ended and power configurations
  • Delivers flexibility and density for many applications

Target Markets & Applications