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BergStik<sup>®</sup> 2.54mm

Overview

Overview

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Description
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Features & Benefits
FEATURES BENEFITS
  • High-temperature thermoplastic material
  • Reflow compatible
  • Variable spacing height for stacking headers
  • Cater to a wide range of applications
  • Allow dual entry, mating from top or bottom
  • Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements
  • Blank 0.64mm square contacts present 4 surfaces of equal quality
  • Can be used for wire wrapping
  • Standoff design
  • Allows cleaning to remove soldering contamination
  • Duplex plating
  • Cost-efficient
  • Tin-lead plating in press-fit area
  • Easy pin insertion onto PCB
  • Retention legs option
  • High retention force onto PCB
  • Press-fit designed to fit 1.02mm diameter hole, solder-to-board products
  • Same layout on THT and press-fit
  • Meets DIN 41651 specification, HE13, and BT D2632
  • Qualified product
Target Market / Application
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Part Numbers

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Test Report

Test Report

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