BergStik^® 2.54mm

Overview

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FEATURES	BENEFITS
High-temperature thermoplastic material	Reflow compatible
Variable spacing height for stacking headers	Cater to a wide range of applications
Allow dual entry, mating from top or bottom	Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements
Blank 0.64mm square contacts present 4 surfaces of equal quality	Can be used for wire wrapping
Standoff design	Allows cleaning to remove soldering contamination
Duplex plating	Cost-efficient
Tin-lead plating in press-fit area	Easy pin insertion onto PCB
Retention legs option	High retention force onto PCB
Press-fit designed to fit 1.02mm diameter hole, solder-to-board products	Same layout on THT and press-fit
Meets DIN 41651 specification, HE13, and BT D2632	Qualified product