BergStak HS™ 0.50mm Mezzanine Connector



  • Housing and terminal profile optimized to 25Gb/s
  • Extension of standard BergStak® 0.80mm and BergStak+™ 0.80mm offering
  • Vertical versus vertical mating configuration
  • 50 position sizes, 12mm stack height available
  • 5 and 8mm stack heights, and up to 120 pin configurations available upon request
  • 0.5mm double-row contact pitch conserves printed circuit board space
  • Scoop-proof feature housings
  • Multiple plating options available
  • Multiple packaging options available
  • PCB locator pegs option
  • RoHS compliant and lead-free
  • Supports high speed performance up to 25Gb/s
  • Supports higher speed applications from PCIe Gen 3, PCIe Gen 4 to 25Gb/s
  • Suitable for parallel board stacking applications
  • Varying positions and height specification meets 25Gb/s requirements
  • High density for all electrical applications needs
  • Prevents reverse mating
  • Satisfies different application requirement
  • Suitable for varies feeding processing
  • Facilitates ease and accuracy during manual assembly
  • Meets environmental, health and safety requirements
Target Market / Application
  • Datacom
  • Telecom
  • Server
  • Storage
Industrial & Instrumentation
  • Embedded Computer
Configure Your Product

Configure Your Product

Configure your Amphenol ICC product by using our Part Configurator below. To download the 3D model and 2D drawing and to generate a datasheet, please login.

Configure product not available for this product series.

Part Numbers

Part Numbers

Part Number Coming Soon.
Test Report

Test Report

Kindly contact Amphenol ICC for test report.

Contact Us