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Bergstak® 0.80mm Pitch

Overview

Overview

Features
  • Housing and terminal profile guarantees support of upto 12Gb/s
  • Vertical versus vertical mating configuration
  • 40 to 200 position sizes in 20 position increments
  • 0.8mm double-row contact pitch conserves printed circuit board space
  • Scoop-proof feature housings
  • Multiple plating options available
  • Multiple packaging options available
  • PCB locator pegs option
  • Available in UL94-V0 material
  • RoHS compliant and lead-free
Benefits
  • Compatible with PCIe Gen 2/3 and SAS 3.0 high speed performance on selected stack heights
  • Suitable for parallel board stacking applications
  • high density for all electrical applications needs
  • Prevents reverse mating
  • Satisfies different application requirement
  • Suitable for varies feeding processing
  • Facilitates ease and accuracy during manual assembly
  • high flammability rating
  • Meets environmental, health and safety requirements
Target Market / Application
Communications
  • Router
  • IP Phone
Data
  • Server
Industrial & Instrumentation
  • Office Equipment
  • Test and Measurement
  • Point-Of-Sale Terminal
  • Portable Industrial Terminal
Medical
  • Diagnostics System
Documentation
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Configure Your Product

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Part Numbers

Part Numbers

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Test Report

Test Report

Kindly contact Amphenol ICC for test report.

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