AgilLink™ 2.00mm Wire-to-Board Header G823

Overview

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Overview

Documentation
Description
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Features & Benefits
FEATURES BENEFITS
  • Customizable pin length, including contact pin and solder tail
  • Suitable for different application and specific designs
  • Various mounting options including vertical DIP, right angle DIP, vertical SMT and right angle SMT
  • Ease in choosing board mating configurations
  • High temperature thermoplastic material
  • Reflow compatible
  • Tape and reel packaging option
  • Supports PIP process
  • RoHS compliance and halogen Free
  • Meets environmental, health and safety requirements
  • Stand-off design
  • Ease of cleaning the PCB
  • Meet USB2.0 and USB3.0 Signal
  • Can meet 3G and 5G speed
  • Mates with Header WTB G862® and Header BTB G827
  • Mutually compatible for wire to board or board to board application

Part Numbers

Target Markets & Applications