0.50mm Board-to-Board

Overview

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Overview

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Documentation
Description
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Features & Benefits
FEATURES BENEFITS
  • Available in 60, 100, 120, 180, 240 position sizes upon request
  • Wide range of options for different application needs
  • Polarization key, and coined feature at pin edge
  • Strengthens lead-in and improves contact wipe during connector mating
  • Snap-in and catch operation
  • Offers superior tactile sense and robust mating operations ensuring strong connection
  • 85Ω differential impedance
  • Optimized high-speed performance at all stack heights
  • Gold flash (8, 15, 30μin) gold plating for reliable mating
  • Improves contact resistance and prevents corrosion
  • 0.10mm max. co-planarity for SMT process
  • Metal Caps and PCB locator pegs are available as options for correct board orientation
  • All stack heights meet PCIe Gen 3, 8GT/s electrical requirements
  • Superior signal integrity (SI) performance

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Target Markets & Applications