• SMT Connectors

    Our portfolio of SMT connectors provides the flexibility, density, and high speed interconnection your next generation designs require.

  • Compression Technology

    Our compression portfolio represents low cost, high signal integrity, high reliability next generation chip-to-board, board-to-board, and flex-to-board interconnection technology.

  • Flexible Circuits &
    Customized Solutions

    Our flexible circuit design capabilities provide limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit.

ABOUT Mezzanine

Amphenol ICC has led the industry in the development and manufacturing of high-performance mezzanine interconnect systems for over 20 years.


Our business specializes in high-speed, high-density interconnection solutions to solve next generation application problems. We bring product innovation and solutions to application problems where space is limited, operating speeds are high, and reliability is a must. We also recognize that the right timing is as important as the right product. We have the technology to handle difficult applications and we can get the right solution to you quickly.


As bandwidth demands increase, the challenge is to achieve higher performance at the lowest possible system costs. With a broad range of packaging solutions, we can help tackle this challenge head-on in the earliest stages of your design cycle.


The Amphenol ICC Mezzanine portfolio offers a wide range of SMT connectors - ranging in mated stack heights from 4mm to 42mm - to meet your board-to-board application requirements, especially when high density and high speed are paramount.

GIG-Array®

GIG-Array®

HIGH-DENSITY BGA ARRAY CONNECTOR Amphenol ICC's GIG-Array® connectors are designed to meet the needs of applications up to 10Gb/s...
InfinX®

InfinX®

OPTIMIZED FOR PERFORMANCE AND DIFFERENTAIL PAIR SIGNALING The InfinX® high-speed mezzanine connector solution is designed to meet the needs of 25+Gb/s...
MEG-Array®

MEG-Array®

MARKET-PROVEN BGA ARRAY CONNECTOR The MEG-Array ® Mezzanine Connector system provides the high density and high-speed benefits of sa large array...
Chameleon®

Chameleon®

ADAPT AND ADVANCE TO THE NEXT GENERATION Designed for fast time-to-market and greater simplicity, Chameleon® has evolved into a highly adaptable...
NeXLev®

NeXLev®

MARKET PROVEN HIGH SPEED MEZZANINE BOARD TO BOARD CONNECTOR Amphenol ICC's NeXLev® is an established and proven high-density parallel board-to-board...
Lynx™

Lynx™

HIGH SPEED AND DOUBLE DENSITY LOW-PROFILE BOARD-TO-BOARD CONNECTOR Amphenol ICC's Lynx™ is a 4-row product offering doubling the density...

Amphenol ICC’s cLGA® land grid array socket system brings conventional connector material construction to a high-performance, low-cost socket design. Millions of cLGA sockets are in use worldwide in demanding applications ranging from handheld consumer products to supercomputer systems.

cLGA®

cLGA®

HIGH PERFORMANCE, LOW COST CHIP-TO-BOARD APPLICATION The Amphenol ICC cLGA® land grid array socket system was designed to bring conventional connector...
cStack™

cStack™

CUSTOMIZABLE SOLDERLESS INTERPOSER-BASED ONE-PIECE STACKER The Amphenol ICC cStack™ high speed solder-less interconnect solution provides limitless...

Amphenol ICC has the capability to customize flexible circuit assemblies to create a wide array of interconnect solutions. We provide application support from the initial flex design through the customized hardware design to create a total system solution.

cStack™ Flexible Circuit Assemblies

cStack™ Flexible Circuit Assemblies

INTERPOSER-BASED FLEX ASSEMBLY FOR BOARD-TO-BOARD APPLICATIONS Amphenol ICC's cStack™ flexible circuit assemblies are designed for applications...