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GEN Z SYSTEM ARCHITECTURE INTERCONNECT SOLUTIONS

High-Performance, High-Speed, High-Density

Mini Cool Edge 0.60mm high density, scalable connectors support Gen Z system architecture, which delivers high performance and enhanced signal integrity. The high speed card edge connectors support both add-in card (AIC) and cabled applications, up to 56G PAM4. Low‐latency communications is also a key benefit of Gen Z applications.

Mini Cool Edge connector specification is defined in SNIA SFF TA1002 while EDSFF and OCP committees adopt it for SSD application and NIC 3.0 application.

Gen Z interconnect solutions should come in 1C, 2C, 4C and 4C+ pin configuration, and vertical, right angle, straddle mount and orthogonal orientation. Mini Cool Edge product family supports all the connector variations above.

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Gen Z Connectors

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  1. Mini Cool Edge 0.60mm Connectors
    Mini Cool Edge 0.60mm Connectors
    HIGH DENSITY HIGH SPEED CONNECTOR FOR VERSATILE BOARD-TO-BOARD APPLICATIONS Mini Cool Edge is a 0.6...
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