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Board to Board | Floating

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Component Type
  1. Floating
Data Rate
  1. 6.2 Gbps 1 item
Gender
  1. Header
  2. Receptacle
Pitch
  1. 0.40mm
  2. 0.50mm
  3. 0.80mm
  4. 1.00mm
Board to Board
  1. Floating
Height Mated
  1. 4.00mm (0.157in);5.00mm (0.197in);6.00mm (0.236in);7.00mm (0.275in)
  2. 4.00mm (0.157in);8.00mm (0.314in)
  3. 4.0mm
  4. 5.00mm (0.197in);9.00mm (0.354in)
  5. 6.00mm (0.236in);10.00mm (0.394in)
  6. 7.00mm (0.275in);11.00mm (0.433in)
  7. 8.00mm (0.314in);9.00mm (0.354in);10.00mm (0.394in);11.00mm (0.433in)
Hold Down
  1. Yes
Housing Height
  1. 18.2mm
  2. 5.0mm
  3. 7.05mm
  4. 8.4mm
  5. 8.8mm
By Alphabetical
  1. B 3 items
  2. F 4 items
  3. 0 1 item
Select Custom Form
  1. Sales Force - Series Form 5 items
  2. Sales Force - Partnumber Form 5 items
Connector Type
  1. Floating
Locating Pegs
  1. No
Material Contact
  1. Brass, Gold Plated
  2. Brass, Tin Alloy Plated
  3. Phosphor Bronze
  4. Phosphor Bronze, Gold Plated
  5. Phosphor Bronze, Tin Alloy Plated
Material Housing
  1. Glass Filled Thermoplastic, UL94 V-0
Number of Contacts
  1. 10
  2. 12
  3. 14
  4. 16
  5. 18
  6. 20
  7. 22
  8. 24
  9. 26
  10. 30
  11. 40
  12. 50
  13. 60
  14. 70
  15. 80
  16. 84
  17. 90
Number of Rows
  1. 2
Orientation
  1. Right Angle
  2. Vertical
Packaging
  1. Tape and Reel 2 items
  2. Tape and reel with cap 1 item
Pitch
  1. 0.4mm(0.0157in)
  2. 0.50mm (0.020in)
  3. 0.80mm (0.031in)
  4. 1.00mm (0.039in)
Plating Contact Area
  1. 0.38μm (15μin) Gold
  2. 0.76μm (30μin) Gold
  3. 2μin Gold plating at contact area, 40 to 120μin Nickel underplating over all
  4. 4μin Min.,Gold plating at contact area; 2μin~ 6μin Gold plating at solder area; 40 to 120μin Nickel underplating over all
  5. Gold
  6. Gold Flash
Retention Feature
  1. Yes 1 item
Tail Plating
  1. Gold
  2. Tin
Termination Style
  1. DIP
  2. Surface Mount
Preferred Parts
  1. Yes
  2. No
Floating Connectors | Board-to-Board Connector | Self Alignment | Amphenol ICC
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