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Board to Board

You can end your search for the perfect board-to-board connector at Amphenol. We offer high-quality and new solutions that are tailored to fit your needs. Our board-to-board connectors are manufactured and designed to help make your life easier by providing best-in-class mechanical and signal integrity performance in a broad range of products coupled with development resources at your disposal.

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Guide Locating Post
Height Mated
  1. 10.00mm (0.394in)
  2. 13.00mm (0.512in);14.00mm (0.551in);15.00mm (0.591in);16.00mm (0.635in)
  3. 13.00mm (0.512in);14.00mm (0.551in);16.00mm (0.635in)
  4. 13.00mm (0.512in);15.00mm (0.591in);16.00mm (0.635in)
  5. 13.00mm (0.512in);16.00mm (0.635in)
  6. 14.00mm (0.551in);15.00mm (0.591in);16.00mm (0.635in)
  7. 17.00mm (0.669in);18.00mm (0.709in);20.00mm (0.787in)
  8. 5.00mm (0.197in);20.00mm (0.787in)
  9. 5.00mm (0.197in);6.00mm (0.236in);7.00mm (0.276in);8.00mm (0.315in)
  10. 5.00mm (0.197in);6.00mm (0.236in);8.00mm (0.315in)
  11. 5.00mm (0.197in);7.00mm (0.276in);8.00mm (0.315in)
  12. 5.00mm (0.197in);7.00mm (0.276in);9.00mm (0.354in);13.00mm (0.512in)
  13. 5.00mm (0.197in);8.00mm (0.315in)
  14. 5.00mm (0.197in);9.00mm (0.354in);13.00mm (0.512in)
  15. 5.00mm (0.197in);9.00mm (0.354in);13.00mm (0.512in);17.00mm (0.669in)
  16. 5.00mm (0.197in);9.00mm (0.354in);13.00mm (0.512in);20.00mm (0.787in)
  17. 5.2mm
  18. 6.00mm (0.236in);10.00mm (0.394in);14.00mm (0.551in);18.00mm (0.709in)
  19. 6.00mm (0.236in);10.00mm (0.394in);14.00mm (0.551in);21.00mm(0.827in)
  20. 6.00mm (0.236in);14.00mm (0.551in)
  21. 6.00mm (0.236in);21.00mm(0.827in)
  22. 6.00mm (0.236in);7.00mm (0.276in);8.00mm (0.315in)
  23. 6.00mm (0.236in);8.00mm (0.315in);10.00mm (0.394in);14.00mm (0.551in)
  24. 7.00mm (0.276in)
  25. 7.00mm (0.276in);11.00mm (0.433in)
  26. 7.00mm (0.276in);15.00mm (0.591in)
  27. 7.00mm (0.276in);8.00mm (0.315in);9.00mm (0.354in);10.00mm (0.394in)
  28. 7.00mm (0.276in);9.00mm (0.354in);10.00mm (0.394in)
  29. 7.00mm (0.276in);9.00mm (0.354in);11.00mm (0.433in);15.00mm (0.591in)
  30. 8.00mm (0.315in);10.00mm (0.394in);12.00mm (0.472in);16.00mm (0.635in)
  31. 8.00mm (0.315in);12.00mm (0.472in)
  32. 8.00mm (0.315in);12.00mm (0.472in);16.00mm (0.635in)
  33. 8.00mm (0.315in);12.00mm (0.472in);16.00mm (0.635in);20.00mm (0.787in)
  34. 8.00mm (0.315in);12.00mm (0.472in);16.00mm (0.635in);23.00mm(0.906in)
  35. 8.00mm (0.315in);16.00mm (0.635in)
  36. 9.00mm (0.354in);10.00mm (0.394in);11.00mm (0.433in);12.00mm (0.472in)
  37. 9.00mm (0.354in);10.00mm (0.394in);12.00mm (0.472in)
  38. 9.00mm (0.354in);11.00mm (0.433in);12.00mm (0.472in)
  39. 9.00mm (0.354in);12.00mm (0.472in)
  40. 13.00mm (0.512in) | 14.00mm (0.551in) | 15.00mm (0.591in) | 16.00mm (0.630in)
  41. 3.00mm (0.118in)
  42. 5.00mm (0.197in)
  43. 5.00mm (0.197in) | 6.00mm (0.236in) | 7.00mm (0.276in) | 8.00mm (0.315in)
  44. 5.00mm (0.197in) | 9.00mm (0.354in) | 13.00mm (0.512in)
  45. 5.00mm (0.197in);9.00mm (0.354in)
  46. 6.00mm (0.236in)
  47. 6.00mm (0.236in);10.00mm (0.394in)
  48. 6mm
  49. 8.00mm (0.315in)
  50. 9.00mm (0.354in) | 10.00mm (0.394in) | 11.00mm (0.433in) | 12.00mm (0.472in)
Number of Walls
Orientation Key Option (Mating Interface)
Plating Contact area
  1. 0.00076mm Au min 1 item
  2. 0.05µm (2.0µin) Gold, with Nickel underplating 1 item
  3. 0.05μm (2.000μin) Gold 2 items
  4. 0.077μm (3.000μin) Gold 1 item
  5. 0.2µm (8µin) Gold with Nickel underplating 1 item
  6. 0.2µm (8µin) Gold with Palladium Nickel underplating 2 items
  7. 0.2µm( 8µin.) Gold 1 item
  8. 0.20μm (8μin) Gold 6 items
  9. 0.25μm (10μin) Gold 4 items
  10. 0.38μin.m (15μin.in) Gold 1 item
  11. 0.38μm (14.960μin) Gold/GXT 2 items
  12. 0.38μm (14.960μin) GXT 2 items
  13. 0.38μm (15μin) Gold 11 items
  14. 0.75μm (29.528μin) Gold 1 item
  15. 0.76 1 item
  16. 0.76µm (30µin) Gold with Nickel underplating 1 item
  17. 0.76μin.m (30μin.in) Gold 1 item
  18. 0.76μm (29.921μin) Gold / GXT™ 2 items
  19. 0.76μm (29.921μin) Gold/GXT 1 item
  20. 0.76μm (29.921μin) GXT™ 3 items
  21. 0.76μm (29.921μin) Min Gold 1 item
  22. 0.76μm (30μin) Gold 12 items
  23. 0.76μm (30μin) Gold 7 items
  24. 0.76μm (30μin.) Gold over 1.27μm (50μin.) Nickel 1 item
  25. 0.80μm (31.496μin) Gold 1 item
  26. 1.02μm (40.157μin) C.I. Gold 1 item
  27. 1.02μm (40.157μin) Gold 1 item
  28. 10μin Gold 2 items
  29. 15μin Gold plating over all, 40 to 120μin Nickel underplating over all 1 item
  30. 2μin Gold plating at contact area, 40 to 120μin Nickel underplating over all 1 item
  31. 2.00μm (78.740μin) Gold 1 item
  32. 2.00μm (78.740μin) Matte Tin 1 item
  33. 2.00μm (78.740μin) Tin 2 items
  34. 2.54μm (100.000μin) Matte Tin 1 item
  35. 2.54μm (100.000μin) Tin 1 item
  36. 30μin. 1 item
  37. 4µin Min Gold over 26µin Pa-Ni 1 item
  38. 5.00μm (196.850μin) Tin 1 item
  39. APP 4 items
  40. Au flash over Ni under plating 2 items
  41. Gold 6 items
  42. Gold Flash 14 items
  43. Gold or GXT, Performanced based 1 item
  44. Matte Tin 1 item
  45. N/A 1 item
  46. Nickel Sulfamate 2 items
  47. NiS 1 item
  48. Performance Based Plating 1 item
  49. Telecom Plating Option that meets Telcordia GR-1217-CORE and NPS25298-2 Specifications 1 item
  50. Tin 3 items
Polarization Feature
Spacing (Board - approx. after soldering)
Voltage Rating
Stocking Program

Board-to-Board Connectors | FCI Basics | BTB Connector | PCB Connector | Fine Pitch & Low Profile

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  1. Paladin® 112Gb/s Backplane Connector
    Paladin® 112Gb/s Backplane Connector
    AMPHENOL'S GAME CHANGING 112Gb/s BACKPLANE INTERCONNECT TECHNOLOGY. Paladin's® revolutionary...
    DETAILS
  2. ExaMAX® 56Gb/s High-Speed Backplane Connector 92Ohm
    ExaMAX® 56Gb/s High-Speed Backplane Connector 92Ohm
    MIGRATION PATH TO HIGHER BANDWIDTH APPLICATIONS ExaMAX® backplane connector system is designed for...
    DETAILS
  3. ExaMAX® 56Gb/s High-Speed Backplane Connector 85Ohm
    ExaMAX® 56Gb/s High-Speed Backplane Connector 85Ohm
    SUPPORTS INTEL QPI/UPI AND MANY OTHER INDUSTRY STANDARD SPECIFICATIONS The ExaMAX® 85Ohms backplane...
    DETAILS
  4. ExaMAX® 56Gb/s High-Speed Orthogonal Connector
    ExaMAX® 56Gb/s High-Speed Orthogonal Connector
    DIRECT-MATE AND MIDPLANE ORTHOGONAL CONFIGURATIONS The ExaMAX® high-speed orthogonal connector system...
    DETAILS
  5. ExaMAX® VS High-Speed Backplane Connector
    ExaMAX® VS High-Speed Backplane Connector
    FORWARD MATING AND FOOTPRINT COMPATIBLE The ExaMAX® VS backplane system is a scalable, cost-optimized...
    DETAILS
  6. 0.35mm Micro Board-to-Board 1.00mm Stack Height - 101 Series
    0.35mm Micro Board-to-Board 1.00mm Stack Height - 101 Series
    HIGH DENSITY MICRO BOARD-TO-BOARD Amphenol's 101 series are 0.35mm pitch micro board-to-board connectors...
    DETAILS
  7. 0.35mm Micro Board-to-Board 0.60mm Stack Height - 103 Series
    0.35mm Micro Board-to-Board 0.60mm Stack Height - 103 Series
    HIGH DENSITY MICRO BOARD-TO-BOARD Amphenol's 103 series are 0.35mm pitch micro board-to-board connectors...
    DETAILS
  8. Elite®
    Elite®
    ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION Ultra-High density 56+ Gbp/s PAM4 interconnect platform...
    DETAILS
  9. XCede® HD Plus
    XCede® HD Plus
    28G ADDITION TO THE XCEDE® HD FAMILY XCede® HD plus leverages the same core technologies...
    DETAILS
  10. XCede® HD
    XCede® HD
    A ROBUST SOLUTION FOR TIGHTER CARD PITCHES AND CHASSIS DESIGNS XCede® HD backplane connector...
    DETAILS
  11. BergStak HS™ 0.80mm Board-to-Board Connector
    BergStak HS™ 0.80mm Board-to-Board Connector
    FLEXIBLE SOLUTION FOR HIGH SPEED APPLICATION FCI Basics BergStak HS™ connector family is known...
    DETAILS
  12. BergStak® 0.80mm Shielded Board-to-Board Connector
    BergStak® 0.80mm Shielded Board-to-Board Connector
    RELIABLE, HIGH-SPEED SHIELDED CONNECTORS FCI Basics BergStak® 0.80mm connector family is known for...
    DETAILS
  13. XCede® Plus Backplane Connector
    XCede® Plus Backplane Connector
    DESIGNED TO ACHIEVE 32G DATA RATE REQUIREMENTS XCede® Plus leverages the same core technologies...
    DETAILS
  14. XCede® Backplane Connector
    XCede® Backplane Connector
    ENABLING FUTURE DATA RATES While maintaining the same mating interfaces, this connector design provides...
    DETAILS
  15. Crossbow™
    Crossbow™
    A DIFFERENTIAL CONNECTOR OPTIMIZED FOR ORTHOGONAL MID-PLANE APPLICATIONS. Crossbow allows designers...
    DETAILS
  16. X2
    X2
    DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS X2's upgraded platform maintains backward mating...
    DETAILS
  17. AirMax VS® 85Ohms High-Speed Backplane Connector
    AirMax VS® 85Ohms High-Speed Backplane Connector
    HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE SUPPORTING INTEL® QPI AirMax VS® 85Ohms connectors...
    DETAILS
  18. AirMax VS® Connectors for CompactPCI® Serial System
    AirMax VS® Connectors for CompactPCI® Serial System
    HARDMETRIC BACKPLANE CONNECTOR SUPPORTING MULTIPLE SERIAL ARCHITECTURES AirMax VS®
    DETAILS
  19. AirMax VSe® High-Speed Backplane Connector
    AirMax VSe® High-Speed Backplane Connector
    HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH ENHANCED PERFORMANCE Next-generation AirMax VSe®...
    DETAILS
  20. AirMax VS® Coplanar High-Speed Backplane Connector
    AirMax VS® Coplanar High-Speed Backplane Connector
    HIGH SPEED HARDMETRIC CONNECTOR SUPPORTING COPLANAR CONFIGURATION AirMax VS® coplanar connectors...
    DETAILS
  21. AirMax VS® Orthogonal High-Speed Backplane Connector
    AirMax VS® Orthogonal High-Speed Backplane Connector
    HIGH SPEED HARDMETRIC CONNECTOR SUPPORTING ORTHOGONAL CONFIGURATION AirMax VS® Orthogonal mid-plane...
    DETAILS
  22. AirMax VS® SBB High-Speed Backplane Connector
    AirMax VS® SBB High-Speed Backplane Connector
    HIGH SPEED HARDMETRIC CONNECTOR FOR STORAGE BRIDGE BAY ARCHITECTURE AirMax VS® high-speed signal...
    DETAILS
  23. AirMax VS2® High-Speed Backplane Connector
    AirMax VS2® High-Speed Backplane Connector
    HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH LOW COST DESIGN AirMax VS2® connectors provide...
    DETAILS
  24. AirMax VS® High-Speed Backplane Connector
    AirMax VS® High-Speed Backplane Connector
    HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH VIRTUAL SHIELD TECHNOLOGY AirMax VS® connectors...
    DETAILS
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Board to Board Connector
Board-to-board connectors connect signals between two printed circuit boards (PCBs) without a cable. At Amphenol, we offer a variety of board-to-board options to fit your specific needs and design these connectors to provide you with the best performance for each application.

  • Backplane - Two daughter cards connected through a common PCB in the back of a chassis form a backplane system. A Right-angle connector on each daughter card connect to the backplane with vertical connectors. Backplanes are typical in top-of-rack switch applications or HHD clusters.
  • Coplanar - Applications where the PCBs are on the same plane and connected by two right-angle connectors.
  • Orthogonal - Applications where the connecting PCBs are orthogonal to each other. This improves airflow and is useful in contemporary networking configurations which implement the spine and leaf structure.
  • Mezzanine - Two connected parallel printed circuit boards at fixed distance apart.
  • Signal - General purpose connectors. The signature of these connectors is the open pin field and are they are generally for low voltage-low current applications. An open pin field means each pin is its own connection and patterns of signals and ground can be determined by the end user. This makes these connectors applicable for the most applications, but they may not be suitable for high performance applications. Bergstak is unique in this group because it has the capability for high-speed signaling.
  • Card Edge - Only requires one connector, because the male connector is formed by plating pads on a PCB. Card edge PCBs can connect perpendicular to the mother board as in PCIe, or can connect in a coplanar configuration.

Benefits of our Board to Board Connectors
Signal Integrity
Signal integrity is a term used to describe the electrical quality of an interconnect. The electrical quality of an interconnect is related to power loss, reflections, and crosstalk. Power loss through an interconnect is quantified as "insertion loss" and is how much power is lost as the signal passes through the interconnect. Reflections are quantified as "return loss" and is how much power is reflected from the interconnect back to the transmitter. Crosstalk is noise generated by other nearby signals that degrades signal performance. Each metric has design targets related to the application. The applications are generally based on a specific protocol or standard.

Amphenol offers board-to-board solutions for every industry standard application. XCede and AirMAX are excellent and proven board-to-board connectors for backplane, mezzanine, orthogonal, or coplanar solutions up to 25Gb/s. The applications for these connectors include IEEE 10GBASE-KR and 25GBASE-KR, or OIF CEI-6G, CEI-11G, CEI-28G. ExaMAX and Paladin are suited for applications of 25Gb/s to 112Gb/s. Applicable industry standards for these best-in-class connectors are include IEEE 25GBASE-KR, 50GBASE-KR, and 100GBASE-KR or OIF CEI-28G, CEI-56G, CEI-112G. Our board-to-board connectors can also be used in PCIe applications for riser cards or control signals. XCede and AirMAX are appropriate for PCIe Gen 1, 2, or 3 and ExaMAX and Paladin should be used for PCIe Gen 4 or higher.

Amphenol also offers Millipacs®, a 2.00 mm grid Interconnection system in hard metric configuration designed in accordance to IEC 917, IEC 61076-4-101, Telcordia GR-1217-CORE standards and fulfills Compact PCI bus architecture. Feature-packed for rugged environments: two-beam twisted tulip contact, header pin length choice for hot swapping, EMI shielding, coding, guiding, high operating temperature, they are ideal for use in rugged and reliable applications in multiple market segments including Industrial & Instrumentation, medical, aviation, railway, military, space, automotive, telecom.

Excellent signal integrity extends to our board-to-board connectors as well. For mezzanine, we offer best-in-class signal integrity with very small stack heights. MEG-Array 56 is design for 56Gb/s applications at a stack height of 4mm. Mini-cool Edge has been optimized for 112G card edge applications.

Amphenol also provides Cool Edge, a high speed and high power card edge connector system that supports most Board-to-Board applications in electronics market. These versatile solutions address multiple standards like PCIe, SAS, SATA, Gen 4/5, OCP 3.0, EDSFF, Gen Z and offer multiple BTB configurations such as mezzanine, coplanar, mid-plane and backplane. Designed as Open Pin Field and hot plug capable make them ideal for applications such as Solid State Drive, NVMe SSD, enterprise data center, Network Interface Card and Add-In Card.

Amphenol's extensive range of vertical PCIe® Gen 4 and Gen 5 connectors include options for surface mount, through hole solder, press-fit and straddle mount terminations. These 1.00mm pitch, vertical and right angle card edge connectors enable all generations of PCI Express® signaling in desktop PCs, workstations, and servers. The connector designs provide support for 2.5GT/s (Gen 1), 5.0GT/s (Gen 2), 8.0GT/s (Gen 3) and recently upgrade to 16GT/s (Gen 4), even further to Gen 5 32GT/s per differential signal pair.

Finally, Bergstak® is an excellent option where cost and performance is paramount. It can deliver speeds in excess of 32Gb/s and has enough pins for both the high-speed and side-band signals. Offering micro pitch from 0.4mm to 0.8mm, connector position options from 10 to 200, and stack height flexibility from 3mm to 20mm, these connectors are designed for use in Industrial, telecom, datacom, automotive and medical applications. This comprehensive range of products is also available in shielded version.

Density
Density is the number of differential pairs and other signals within an area. To calculate density, divide the number of signals of a connector by the area its footprint occupies. It is typically quantified in differential pairs per inch squared. The density of a connector is directly related to its column and row pitch. As the pitch becomes smaller, the density increases. As the pitch of SERDES BGAs decreases, demand increases for connector pitch reduction.

Amphenol offers board-to-board solutions for low and high-density applications. In applications where one rack separation matters, AirMAX, XCede, and ExaMAX have solutions up to 128 differential pairs per connector. BergStak® 0.8mm is a comprehensive, versatile and flexible solution designed for high speed and high density. Other applications may necessitate density within the chassis instead of the front panel. In these applications we offer connectors with tight pin pitch. Examples are MEG-Array which is a grid of 1mm high speed signals and grounds or BergStak as low as 0.4mm signals spacing.

Stack Heights
In mezzanine applications, the distance between the two stacked interconnected boards. Backplane connectors that have been adapted to mezzanine applications typically have stack heights from 15mm to 55mm. Products with stack heights like these are ExaMEZZ, InfinX, and GIG-Array. BergStak® and BergStik® product families can cover a wide range from 3mm to 63mm. However, many mezzanine connectors are designed for very tight stack heights with very high density. These connectors include MEG-Array and Chameleon which have minimum stack heights of 4mm and 6mm respectively with Chameleon's tight pitch at 0.9mm.

Cost
The cost of an interconnect can be as simple as a piece price, and interconnect cost is also discussed in terms of price per differential pair.

Amphenol offers low-cost board-to-board solutions. AirMAX and XCede are time-tested solutions for up to 25Gb/s at extremely competitive prices. ExaMAX VS is an introductory solution for 25Gb/s applications and is mating compatible with our latest 112Gb/s version of ExaMAX. BergStak® Lite 0.8mm is an economical version that uses Gold Flash plating that can meet up to 50 mating cycles, from 40 to 100 position sizes in 20 position increments and from 5mm to 20mm stack heights in 1mm increments.

Volume
Amphenol is a very large scale (VLS) manufacturer. We have delivered over 10 billon differential pairs to our customers world-wide, and we have the capacity to deliver our products in volume wherever you may be.

Power
Many connectors offer integrated power delivery solutions, or you can pair any of our hard-metric backplane connectors with our hard-metric power connectors to deliver over 100A along side your high-speed signals. In less demanding mezzanine applications, Chameleon can deliver 2.5A per contact. EnergyEdge™ X-treme's dual contact design can handle 3000W at 12V and offers the highest linear density available in the market today. Featuring twice as many contact points, it allows for a 25% improvement in linear current density when compared to existing card edge products. Its more compact design provides up to a 23% size reduction compared to eHPCE®, carrying 3000W in the same 43mm space. Available in straddle mount, right angle, right angle coplanar and vertical configurations.