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Tag Archives: QSFP DD

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The Server – The Commodity wonder child of the Data Center

The Server – The Commodity wonder child of the Data Center

The online world depends on Data Centers.  They occupy large building spaces that house servers and the accompanying storage and network. Servers take the centerstage when it comes to the online experience.  They are known as service-driven, application-specific computing machines that are highly adaptable.  They are reliable and capable of virtualization and consolidation, making daily operations simpler for network and database administrators.

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ODCC Summit 2019 – Amphenol ICC’s High Speed Interconnect Solutions

ODCC Summit 2019 – Amphenol ICC’s High Speed Interconnect Solutions

Amphenol ICC is a global provider of high speed interconnects solutions to designers and manufacturers of Internet-enabling systems. Whether industry-standard or application-specific, we provide our customers with products that enable performance at the leading edge of next-generation, high-speed technology.

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Amphenol ICC Data & Communications Showcases at Electronica China

Amphenol ICC Data & Communications Showcases at Electronica China

Amphenol ICC is featuring a wide variety of solutions in electronica China this year. Here is a sneak peek in our Data and Communications showcase.

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OverPass™ - The High Speed Solution

OverPass™ - The High Speed Solution

Amphenol’s OverPass cable system offers a broad range that allow customers to efficiently take high speed signal from near the ASIC to anywhere in their system.

Amphenol’s OverPass™ cable system allows for the transfer of high-speed signals to twinax cables shortly after they are launched from the ASIC.

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Explore Amphenol Solutions at DesignCon 2019

Explore Amphenol Solutions at DesignCon 2019

Amphenol will be showcasing the widest selection of high-speed solutions this year. Here's a sneak peek of our show exhibits:

High Speed IO Solutions

Adhering to the high-speed theme, our High Speed IO connector and cable solutions include OverPass, Mini-SAS HD, [Read more]

OverPass™ Interconnects – Your high speed , Low Loss Chip-to-Module Interconnect Solution

OverPass™ Interconnects – Your high speed , Low Loss Chip-to-Module Interconnect Solution

Amphenol ICC’s OverPass cabling Interconnect solution addresses hardware designer / architect’s need for a lower loss signal transmission path from the ASIC chip site to the external IO port or pluggable module interface.  The system transfers high-speed signals to twinax cables shortly after they are launched from the chip and delivers a direct link to the external port when compared to the more typical transmission through the PCB line or system card. The [Read more]

Amphenol ICC’s Data & Communications Product Lines on Final Day of Electronica 2018

Amphenol ICC’s Data & Communications Product Lines on Final Day of Electronica 2018

As the final day of the event is approaching, here is a sneak peek in our Data and Communications showcase at Electronica 2018.

Cool Edge

Cool Edge is a high speed and high power board to board connector system addressing multiple standards like PCIe, SAS, SATA, Gen 4/5, OCP 3.0, EDSFF, NGSFF/NF1, Gen Z. It is offered in different configurations like mezzanine, coplanar, midplane and backplane, making it suitable for applications in data and communication such as S [Read more]

Evolution of Data Communication Standards

Evolution of Data Communication Standards

As the computer industry grows, data centers are going through a constant evolution to meet the increasing data management demand. Data centers have to change to accommodate the new designs, increased complexity, higher speeds, and higher densities.

Server racks were initially designed to support early data center design and development. However, the constant changes lead to the requirement of creating a common connector interface or standard. 

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OSFP – Defining a New Standard for High-Speed Connections

OSFP – Defining a New Standard for High-Speed Connections

The emergence of large-scale data centers leads to high demand for higher signal speeds, bandwidth, and higher density connections to meet their complex designs and configurations.

Developing a standardized pattern was indispensable for the advancement of data center design and data management capabilities. Thus the Small Form Factor (SFF) committee was organized and they established a Multi-Source Agreement (MSA) which provides standards for connector manufacturers and network compon [Read more]

Amphenol – Bigger and Better at DesignCon 2018

Amphenol – Bigger and Better at DesignCon 2018

DesignCon is back for its 23rd year with exciting experiences for engineers across the globe. From January 30 - February 1, 2018, DesignCon 2018 is three jam packed days of interesting events conducted at the Santa Clara Convention Center.

Like the previous years, Amphenol is excited to be a part of this grand expo and conference. This time, we are back with the biggest 20’ x 50’ booth to showcase our latest interconnection technologies from more than 8 business units.

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Meet Amphenol ICC at SC17 Conference - Denver

Meet Amphenol ICC at SC17 Conference - Denver

Amphenol ICC will be at the upcoming SC17 Conference in Denver from November 12th - 17th 2017.

The SC17 conference is an international show focusing on high performance computing, networking, storage and analysis.  Amphenol will be participating with the Ethernet Alliance group and will be displaying the latest high performance technology in interconnect solutions. Conference attendees are encouraged to stop by the booth to learn more about products like the OSFP conne [Read more]