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Tag Archives: Paladin
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Open Compute Project (OCP) is making more efficient and scalable hardware and creating a new image for IT infrastructure. Every year OCP Global Summit will bring together expert developers, suppliers, engineers, executives and decision-makers around the globe to showcase and discuss the amazing technological enhancements happening in the world.[Read more]
5G connectivity is no longer fictional, as many networks around the world have already developed infrastructure and devices to support the improved speed, capacity, and bandwidth of 5G networks. Within the next decade, most of the industry will utilize this technological revolution to create uncompromising and innovative products and applications.[Read more]
System designers are encountering new architectural challenges as single lane data rates are continuing to increase. Next generation SerDes devices d, will soon be scaling to 112Gbps PAM4. A major obstacle in system design is the challenge of passing 112Gb/s high frequency signals through PCB without loss.[Read more]
Amphenol ICC is featuring a wide variety of solutions in electronica China this year. Here is a sneak peek in our Data and Communications showcase.[Read more]
The 18th edition of electronica China will take place from 20 to 22 March 2019 at Shanghai New International Expo Centre. Amphenol ICC will be showcasing the widest selection of high-speed solutions this year. Here's a sneak peek of our show exhibits:[Read more]
Amphenol’s OverPass™ cable system offers a broad range that allow customers to efficiently take high speed signal from near the ASIC to anywhere in their system.
Amphenol’s OverPass™ cable system allows for the transfer of high-speed signals to twinax cables shortly after they are launched from the ASIC.[Read more]
Amphenol ICC’s OverPass™ cabling Interconnect solution addresses hardware designer / architect’s need for a lower loss signal transmission path from the ASIC chip site to the external IO port or pluggable module interface. The system transfers high-speed signals to twinax cables shortly after they are launched from the chip and delivers a direct link to the external port when compared to the more typical transmission through the PCB line or system card. The [Read more]
As the final day of the event is approaching, here is a sneak peek in our Data and Communications showcase at Electronica 2018.
Cool Edge is a high speed and high power board to board connector system addressing multiple standards like PCIe, SAS, SATA, Gen 4/5, OCP 3.0, EDSFF, NGSFF/NF1, Gen Z. It is offered in different configurations like mezzanine, coplanar, midplane and backplane, making it suitable for applications in data and communication such as S [Read more]
Communication and networking is an ever growing industry. The transformation from one generation to the next has been relentless. 1G technology was analog cellular, 2G used technologies like CDMA, GSM, and TDM to make the first giant leap towards digital communications. The speed concepts were reframed from Kbps to few Mbps with the introduction of 3G technologies like EVDO, HSPA, and UMTS.[Read more]
Backplane connectors are basic electrical connectors that help in connecting one PCB to other. The backplane connector adds mechanical strength and stability to the design. These can be widely classified into 3 types based on their speed.[Read more]
Here’s what’s on show from Amphenol ICC
Amphenol ICC's game changing 112Gb/s backplane interconnect technology - Paladin®, is the highlight product of the year. Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects and enables our customers to design complex systems.[Read more]