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Tag Archives: Paladin

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Direct Orthogonal Architecture:  Signal Speed Benefits, Mechanical Risks and Solutions

Direct Orthogonal Architecture: Signal Speed Benefits, Mechanical Risks and Solutions

System designers are encountering new architectural challenges as single lane data rates are continuing to increase. Next generation SerDes devices d, will soon be scaling to 112Gbps PAM4. A major obstacle in system design is the challenge of passing 112Gb/s high frequency signals through PCB without loss. 

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Amphenol ICC Data & Communications Showcases at Electronica China

Amphenol ICC Data & Communications Showcases at Electronica China

Amphenol ICC is featuring a wide variety of solutions in electronica China this year. Here is a sneak peek in our Data and Communications showcase.

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Check out Amphenol ICC Solutions at Electronica China 2019

Check out Amphenol ICC Solutions at Electronica China 2019

The 18th edition of electronica China will take place from 20 to 22 March 2019 at Shanghai New International Expo Centre. Amphenol ICC will be showcasing the widest selection of high-speed solutions this year. Here's a sneak peek of our show exhibits:

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OverPass™ - The High Speed Solution

OverPass™ - The High Speed Solution

Amphenol’s OverPass cable system offers a broad range that allow customers to efficiently take high speed signal from near the ASIC to anywhere in their system.

Amphenol’s OverPass™ cable system allows for the transfer of high-speed signals to twinax cables shortly after they are launched from the ASIC.

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Explore Amphenol Solutions at DesignCon 2019

Explore Amphenol Solutions at DesignCon 2019

Amphenol will be showcasing the widest selection of high-speed solutions this year. Here's a sneak peek of our show exhibits:

High Speed IO Solutions

Adhering to the high-speed theme, our High Speed IO connector and cable solutions include OverPass, Mini-SAS HD, [Read more]

OverPass™ Interconnects – Your high speed , Low Loss Chip-to-Module Interconnect Solution

OverPass™ Interconnects – Your high speed , Low Loss Chip-to-Module Interconnect Solution

Amphenol ICC’s OverPass cabling Interconnect solution addresses hardware designer / architect’s need for a lower loss signal transmission path from the ASIC chip site to the external IO port or pluggable module interface.  The system transfers high-speed signals to twinax cables shortly after they are launched from the chip and delivers a direct link to the external port when compared to the more typical transmission through the PCB line or system card. The [Read more]

Amphenol ICC’s Data & Communications Product Lines on Final Day of Electronica 2018

Amphenol ICC’s Data & Communications Product Lines on Final Day of Electronica 2018

As the final day of the event is approaching, here is a sneak peek in our Data and Communications showcase at Electronica 2018.

Cool Edge

Cool Edge is a high speed and high power board to board connector system addressing multiple standards like PCIe, SAS, SATA, Gen 4/5, OCP 3.0, EDSFF, NGSFF/NF1, Gen Z. It is offered in different configurations like mezzanine, coplanar, midplane and backplane, making it suitable for applications in data and communication such as S [Read more]

5G Wireless- The Faster Technology for Tomorrow

5G Wireless- The Faster Technology for Tomorrow

Communication and networking is an ever growing industry. The transformation from one generation to the next has been relentless. 1G technology was analog cellular, 2G used technologies like CDMA, GSM, and TDM to make the first giant leap towards digital communications. The speed concepts were reframed from Kbps to few Mbps with the introduction of 3G technologies like EVDO, HSPA, and UMTS. 

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Industry-Proven Backplane Connectors to Suit Your Speed Requirements

Industry-Proven Backplane Connectors to Suit Your Speed Requirements

Backplane connectors are basic electrical connectors that help in connecting one PCB to other. The backplane connector adds mechanical strength and stability to the design. These can be widely classified into 3 types based on their speed. 

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See You at DesignCon 2018

See You at DesignCon 2018

Here’s what’s on show from Amphenol ICC

Paladin®

Amphenol ICC's game changing 112Gb/s backplane interconnect technology - Paladin®, is the highlight product of the year. Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects and enables our customers to design complex systems.

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Amphenol's Game-Changing 112 Gb/s Backplane Interconnect Technology

Amphenol's Game-Changing 112 Gb/s Backplane Interconnect Technology

With a speed twice as much as the industry standard, Paladin’s® game-changing 112 Gb/s backplane interconnect technology sets the benchmark for signal integrity performance in backplane interconnects.

It has no stub resonance from signal contacts and demonstrates a smooth linear transmission beyond 40GHz. Paladin® has the lowest crosstalk in the market and impedance control over the entire mating range enabling customers to design complex systems th [Read more]

Amphenol – Bigger and Better at DesignCon 2018

Amphenol – Bigger and Better at DesignCon 2018

DesignCon is back for its 23rd year with exciting experiences for engineers across the globe. From January 30 - February 1, 2018, DesignCon 2018 is three jam packed days of interesting events conducted at the Santa Clara Convention Center.

Like the previous years, Amphenol is excited to be a part of this grand expo and conference. This time, we are back with the biggest 20’ x 50’ booth to showcase our latest interconnection technologies from more than 8 business units.

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