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Tag Archives: OSFP

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ODCC Summit 2019 – Amphenol ICC Product Showcase

ODCC Summit 2019 – Amphenol ICC Product Showcase

ODCC Summit 2019 is just a few days away. Like previous years, Amphenol ICC is extending a wide variety of solutions in the Summit. Read on to learn more about our showcase this year.

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ODCC Summit 2019 – Amphenol ICC’s High Speed Interconnect Solutions

ODCC Summit 2019 – Amphenol ICC’s High Speed Interconnect Solutions

Amphenol ICC is a global provider of high speed interconnects solutions to designers and manufacturers of Internet-enabling systems. Whether industry-standard or application-specific, we provide our customers with products that enable performance at the leading edge of next-generation, high-speed technology.

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Amphenol ICC Data & Communications Showcases at Electronica China

Amphenol ICC Data & Communications Showcases at Electronica China

Amphenol ICC is featuring a wide variety of solutions in electronica China this year. Here is a sneak peek in our Data and Communications showcase.

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Check out Amphenol ICC Solutions at Electronica China 2019

Check out Amphenol ICC Solutions at Electronica China 2019

The 18th edition of electronica China will take place from 20 to 22 March 2019 at Shanghai New International Expo Centre. Amphenol ICC will be showcasing the widest selection of high-speed solutions this year. Here's a sneak peek of our show exhibits:

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Come visit us at electronica China, OFC and OCP!

Come visit us at electronica China, OFC and OCP!

Wherever you may be in the world, you may have a chance to see Amphenol’s latest solutions at Electronica China, OFC and OCP. Join us at the following events:

The Optical Networking and Communication Conference & Exhibition

(OFC) is the largest international conference that brings together attendees from all over the world to exchange their expertise, discuss new innovations and make connections in the optical communications and networking industry for the pas [Read more]

OverPass™ - The High Speed Solution

OverPass™ - The High Speed Solution

Amphenol’s OverPass cable system offers a broad range that allow customers to efficiently take high speed signal from near the ASIC to anywhere in their system.

Amphenol’s OverPass™ cable system allows for the transfer of high-speed signals to twinax cables shortly after they are launched from the ASIC.

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Amphenol ICC’s OSFP IO system is awarded the Electronic Products Magazine Product of the Year Award!!

Amphenol ICC’s OSFP IO system is awarded the Electronic Products Magazine Product of the Year Award!!

It is a proud moment for Amphenol ICC as we have been awarded the Product of the Year Award in the “Interconnects” category of Electronic Products magazine. With a legacy of 43years, Electronic Products Annual awards are one of the most coveted awards in the industry. 100+ products were evaluated under 10 different categories before the winners were announced. Amphenol ICC’s OSFP Interconnect System was chosen as the best “Interconnect” product 

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Explore Amphenol Solutions at DesignCon 2019

Explore Amphenol Solutions at DesignCon 2019

Amphenol will be showcasing the widest selection of high-speed solutions this year. Here's a sneak peek of our show exhibits:

High Speed IO Solutions

Adhering to the high-speed theme, our High Speed IO connector and cable solutions include OverPass, Mini-SAS HD, [Read more]

OverPass™ Interconnects – Your high speed , Low Loss Chip-to-Module Interconnect Solution

OverPass™ Interconnects – Your high speed , Low Loss Chip-to-Module Interconnect Solution

Amphenol ICC’s OverPass cabling Interconnect solution addresses hardware designer / architect’s need for a lower loss signal transmission path from the ASIC chip site to the external IO port or pluggable module interface.  The system transfers high-speed signals to twinax cables shortly after they are launched from the chip and delivers a direct link to the external port when compared to the more typical transmission through the PCB line or system card. The [Read more]

Evolution of Data Communication Standards

Evolution of Data Communication Standards

As the computer industry grows, data centers are going through a constant evolution to meet the increasing data management demand. Data centers have to change to accommodate the new designs, increased complexity, higher speeds, and higher densities.

Server racks were initially designed to support early data center design and development. However, the constant changes lead to the requirement of creating a common connector interface or standard. 

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See You at DesignCon 2018

See You at DesignCon 2018

Here’s what’s on show from Amphenol ICC

Paladin®

Amphenol ICC's game changing 112Gb/s backplane interconnect technology - Paladin®, is the highlight product of the year. Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects and enables our customers to design complex systems.

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OSFP – Defining a New Standard for High-Speed Connections

OSFP – Defining a New Standard for High-Speed Connections

The emergence of large-scale data centers leads to high demand for higher signal speeds, bandwidth, and higher density connections to meet their complex designs and configurations.

Developing a standardized pattern was indispensable for the advancement of data center design and data management capabilities. Thus the Small Form Factor (SFF) committee was organized and they established a Multi-Source Agreement (MSA) which provides standards for connector manufacturers and network compon [Read more]