Tag Archives: New Products

Three high-speed products were introduced to the Amphenol ICC product portfolio in the month of August. Double Density Cool Edge Connectors and BergStak^® FX10 offers high-speed high-density board to board solutions and the microSD Express Connector uses PCI express 4.0 protocol rated up to 16Gb/s making it a high-performance memory card connector compliant to SD specification V7.1

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In April, Amphenol extended our portfolio of BTB and FFC/FPC connectors with the acquisition of Aorora. Almost 400 Aorora parts are now searchable with datasheets, 2D drawings, 3D models and product specifications. Read on to learn more about the 4 key product lines.

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Amphenol ICC added three new products to our high speed and high-density portfolio in June. The high-speed SAS/PCIe 5.0 (U.2 & U.3) connectors come with 32GT/s (PCIe lanes) and 24Gb/s (SAS lanes) speeds to meet the demands of next-generation servers. The 3000W EnergyEdge^™ X-treme Card Edge series is the highest linear density card edge connectors available in the market today.

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Amphenol ICC introduced 2 new products in May. While the rugged MRU series USB 2.0 was added to the harsh environment connectors, the RJE1R extended the modular jack series. [Read more]

We are excited to share our newest products. Our engineers are consistently delivering innovative solutions to meet the growing needs of our customers. [Read more]