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Tag Archives: New Products
AICC CONNECT: CONNECT WITH OUR LATEST NEWS
Check this space to learn how our products can make tomorrow’s technology
In October 2019, Amphenol ICC introduced two new products. F323 series was added to our 0.50mm FFC/FPC connector range. HSC connector is the second in the list. This USCAR compliant compact high speed interconnect system supports data rates up to 1Gb/s and more.[Read more]
In September, Amphenol ICC launched 4 new products. PwrMAX® G2 is the highest density blind mate power and signal connector available in the market today and Mezzostak® 0.50mm with an innovative hermaphroditic design is a robust fine-pitch mezzanine connector solution. While IPS series offer an integrated cable solution for high-speed card edge connectors like PCIe, the new MXM connector provides an advanced high-density PCIe® [Read more]
Three high-speed products were introduced to the Amphenol ICC product portfolio in the month of August. Double Density Cool Edge Connectors and BergStak® FX10 offers high-speed high-density board to board solutions and the microSD Express Connector uses PCI express 4.0 protocol rated up to 16Gb/s making it a high-performance memory card connector compliant to SD specification V7.1[Read more]
Amphenol ICC added three new products to our high speed and high-density portfolio in June. The high-speed SAS/PCIe 5.0 (U.2 & U.3) connectors come with 32GT/s (PCIe lanes) and 24Gb/s (SAS lanes) speeds to meet the demands of next-generation servers. The 3000W EnergyEdge™ X-treme Card Edge series is the highest linear density card edge connectors available in the market today.[Read more]