Tag Archives: New Products

Amphenol has introduced three main solutions in August.  Which includes 0.35mm pitch micro board-to-board connectors designed for high-density applications, the next generation of custom power solution with up to 125A per contact, and a modified ultra-slim D-Sub connector.

Amphenol FCI Basics has introduced 4 new connectors into its array of the board-to-board and crimp-to-wire connector product lines in the month of July. The Minitek^® MicroSpeed connectors are shielded high-speed connectors up to 25Gb/s. 

BergStak^® and Minitek^® are two profound brands from FCI Basics. In April, two new products were introduced to these connector families: BergStak^® 0.80mm shielded board-to-board connector and Minitek^® Board-In 2.00mm and 2.50mm connector. 

Three new products were added to the Amphenol product array in February. FCI Basics BergStak HS^™ connector family known for its fast data transmission, high signal quality, and time-proven reliability was extended with two new additions including BergStak HS^™ 0.80mm and BergStak^® 0.50mm self-alignment connectors. 

Amphenol ICC launched the new Cross-Mate^™ 2.00mm to mark the beginning of 2020 in January. These wire-to-board connectors offer a compact design and can be used in various applications in consumer, industrial, medical and automotive fields.