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Tag Archives: Mini Cool Edge IO

AICC CONNECT: CONNECT WITH OUR LATEST NEWS

Check this space to learn how our products can make tomorrow’s technology

Product Demonstrations at DesignCon 2020

Product Demonstrations at DesignCon 2020

DesignCon provides an unparalleled opportunity to check out the latest and most innovative products in the market. Throughout the event, you have access to more than 5,000 design engineers and other industry experts, demonstrations and presentations. In addition to Amphenol’s extensive product solutions [Read more]

OverPass™ - The High Speed Solution

OverPass™ - The High Speed Solution

Amphenol’s OverPass cable system offers a broad range that allow customers to efficiently take high speed signal from near the ASIC to anywhere in their system.

Amphenol’s OverPass™ cable system allows for the transfer of high-speed signals to twinax cables shortly after they are launched from the ASIC.

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OverPass™ Interconnects – Your high speed , Low Loss Chip-to-Module Interconnect Solution

OverPass™ Interconnects – Your high speed , Low Loss Chip-to-Module Interconnect Solution

Amphenol ICC’s OverPass cabling Interconnect solution addresses hardware designer / architect’s need for a lower loss signal transmission path from the ASIC chip site to the external IO port or pluggable module interface.  The system transfers high-speed signals to twinax cables shortly after they are launched from the chip and delivers a direct link to the external port when compared to the more typical transmission through the PCB line or system card. The [Read more]

Mini Cool Edge IO – The Ideal Solution to Transmit Next Generation High-Speed Signal to Designated Area in Your System

Mini Cool Edge IO – The Ideal Solution to Transmit Next Generation High-Speed Signal to Designated Area in Your System

The development of Big Data, IoT, 5G, and other high-end applications requires signal transmission speed to a istorical high. The most common signal transmission medium – Printed Circuit Board, has limitations in high-speed environments. Due to the natural characteristic of common PCB materials, severe signal distortion happens through signal route and form a serious barrier in system design, thus obstructing the development of high-end applications. 

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