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Tag Archives: MIni Cool Edge

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Gen Z – The Next Gen Computing Architecture

Gen Z – The Next Gen Computing Architecture

The world is demanding higher levels of computing performances. It is the need of the day to develop a system that meets the massive data requirements without compromising on the security. Gen Z is an answer to that question.

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Meet Us at Flash Memory Summit 2019

Meet Us at Flash Memory Summit 2019

Flash Memory Summit is one of the greatest platforms for all industries associated with flash memory and its applications. This year, the event will take place at Santa Clara Convention Center, CA from 6th to 8th of August 2019.  The Summit theme this year includes Flash Memory Based Architectures, PCIe/NVMe, SSDs Solid State Drives (SSDs), Enterprise Applications and Storage, Controllers, persistent memory, new non-volatile memory technologies, standards, testing, and applications.

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Traditional Data Center Converges to HCI

Traditional Data Center Converges to HCI

The three components of data centers are compute, storage, and network.  Arranged in racks, towers, or silos, the servers (or compute) work with an array of hard or solid state drives (storage) and connect to the outside through rack-mounted switches (network).  The data center customer orders each component from selected hardware vendors and integrates them into a functional unit.  

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Industry Standard Connectors For Next-Generation Applications

Industry Standard Connectors For Next-Generation Applications

Different connector manufacturers within an industry develop their own electrical components for a wide range of applications. Even when product specifications remain the same, there are differences in the quality, size, shape, and materials used, thus, affecting application designs and architectures. Industry standards are defined to clear these discrepancies. These are rules and regulations made by a consortium of similar-minded industrialists to bring a unified approach to carry out severa [Read more]

Cool Edge – High Speed & High Power Card Edge

Cool Edge – High Speed & High Power Card Edge

Amphenol ICC’s Cool Edge is a high speed and high power card edge connector system that supports most BTB applications in electronics market. 

These versatile solutions address multiple standards like PCIe, SAS, SATA, Gen 4/5, OCP 3.0, EDSFF, NGSFF/NF1, Gen Z  and offer multiple BTB configurations such as mezzanine, coplanar, midplane and backplane. Moreover, the connectors are designed as Open Pin Field and are hot plug capable.

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Flash Memory Summit 2018 - Enabling The Electronics Revolution

Flash Memory Summit 2018 - Enabling The Electronics Revolution

Flash Memory Summit is the world’s largest conference discussing the trends, innovations in flash memory and its applications like smart phones, tablets, mobile and embedded systems. It will take place from 7 to 9 August 2018 at Santa Clara Convention Center, USA. 

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Mini Cool Edge: Fine Pitch and Versatile Connectors

Mini Cool Edge: Fine Pitch and Versatile Connectors

Introduction of Cool Edge connectors is a revolutionary move by Amphenol ICC in data center engineering. The Cool Edge family started to expand with different pitches and higher performance with each new addition to the product series range. When the standard connectors offer a fine pitch of 0.8mm and 0.65mm, it helps in reducing the PCB footprints along with enhancing the efficiency. 

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