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Tag Archives: M Series 56

AICC CONNECT: CONNECT WITH OUR LATEST NEWS

Check this space to learn how our products can make tomorrow’s technology

Solid State Drive and Mezzanine products under PCIe Gen 4

Solid State Drive and Mezzanine products under PCIe Gen 4

Enterprise SSDs offer enhanced endurance and power features to keep mission-critical environments up and running. Amphenol ICC offers an extended range of Solid State Drive (SSD) interconnect solutions based on 4th generation PCIe standards.

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Amphenol ICC Industrial & Automotive Showcases at Electronica China

Amphenol ICC Industrial & Automotive Showcases at Electronica China

Amphenol ICC has a broad array of innovative technology and solutions to support Industry 4.0 and the Automotive industry. Come see the star products in our Industrial and Automotive showcase:

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Explore Amphenol Solutions at DesignCon 2019

Explore Amphenol Solutions at DesignCon 2019

Amphenol will be showcasing the widest selection of high-speed solutions this year. Here's a sneak peek of our show exhibits:

High Speed IO Solutions

Adhering to the high-speed theme, our High Speed IO connector and cable solutions include OverPass, Mini-SAS HD, [Read more]

Amphenol ICC’s Industrial & Automotive Product Lines at Electronica 2018

Amphenol ICC’s Industrial & Automotive Product Lines at Electronica 2018

Electronica 2018 has begun at the Messe München on 13 November. We hope to meet you at our Electronica booth, if not, here are some key product highlights to share what you’ve missed.  

Minitek MicroSpace

With Gold/GXT® contacts enabling current rating up to 4A per contact and durability up to 100 mating cycles, Minitek MicroSpace Crimp-to-Wire connector platform's unique design enables LV214 S [Read more]

M-Series™ 56 – Advanced Ball Grid Array (BGA) Connector for 56Gb/s NRZ, 112Gb/s PAM-4 Performance

M-Series™ 56 – Advanced Ball Grid Array (BGA) Connector for 56Gb/s NRZ, 112Gb/s PAM-4 Performance

The rapid acceleration of technology evolution can be seen in the disruptive products regularly entering the market today.  Advanced datacenters, crypto currency mining, autonomous vehicles, deep learning, and artificial intelligence applications are upending their spaces. Disruptive innovation challenges engineers to develop increasingly integrated designs with enhanced efficiency.

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