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Tag Archives: HPCE
AICC CONNECT: CONNECTION GUIDES
Check this blog to learn how our products are enabling the electronics revolution
25% Increase in Current Density Compared to Existing Card Edge Designs!
The NEW 3000W EnergyEdge™ X-treme Card Edge series offers the highest linear density available in the market today. X-treme’s revolutionary dual contact design pushes the boundaries of card edge technology beyond 3000W to power modern system architectures.[Read more]
APEC is one of the premier events in applied power electronics that brings together more than 45,000 professionals from around the world for networking, hands-on learning, and strategic business development. APEC focuses on the practical and applied aspects of the power electronics business.[Read more]
As the hyperscale community prepares to ramp up implementation efforts, Amphenol ICC Power Solutions has already designed the next generation of power distribution solutions to best fit hyperscale needs efficiently. Most importantly, our broad range of hyperscale compliant solutions such as Barklip® IO, [Read more]
Major OEM and component manufacturers including Amphenol ICC are collaborating to help data center designers shed their proprietary outlook and go open source.
Open Compute Alliance
A consortium known as the Open Compute Project Foundation (OCP) endorses and publicly releases data center designs from its member OEMs like Facebook and Microsoft. These designs can be utilized by every other aspiring vendor to their clients’ benefit.   [Read more]