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Tag Archives: Gen Z
AICC CONNECT: CONNECTION GUIDES
Check this blog to learn how our products are enabling the electronics revolution
Flash Memory Summit (FMS), the world’s premiere flash memory conference and exposition brings together storage designers, integrators, and IT storage professionals from around the world to create the most competitive, high-performance storage solutions. Amphenol is proud to be the part of the Virtual FMS this year, taking place from November 10th to 12th 2020.[Read more]
DesignCon being the largest chip, board, and systems event in the industry witnesses the launch of many innovative products. Amphenol ICC will be is launching three high-speed server connectors at DesignCon 2020: Right Angle PCIe® Gen 4 CEM connectors, Gen Z 4C-HP Mini Cool Edge connectors and Double Density Cool Edge connectors.[Read more]
As the final day of the event is approaching, here is a sneak peek in our Data and Communications showcase at Electronica 2018.
Cool Edge is a high speed and high power board to board connector system addressing multiple standards like PCIe, SAS, SATA, Gen 4/5, OCP 3.0, EDSFF, NGSFF/NF1, Gen Z. It is offered in different configurations like mezzanine, coplanar, midplane and backplane, making it suitable for applications in data and communication such as S [Read more]