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Tag Archives: Flash Memory Summit
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Mini Cool Edge IO – The Ideal Solution to Transmit Next Generation High-Speed Signal to Designated Area in Your System
The development of Big Data, IoT, 5G, and other high-end applications requires signal transmission speed to historical high. The most common signal transmission medium – Printed Circuit Board, has limitations under high-speed environment. Due to the natural characteristic of common PCB materials, severe signal distortion happens through signal route and form a serious barrier in system design, thus obstructing the development of high-end applications. Amphenol ICC introduces Mini Cool E [Read more]
Different connector manufacturers within an industry develop their own electrical components for a wide range of applications. Even when product specifications remain the same, there are differences in the quality, size, shape, and materials used, thus, affecting application designs and architectures. Industry standards are defined to clear these discrepancies. These are rules and regulations made by a consortium of similar-minded industrialists to bring a unified approach to carry out severa [Read more]
Amphenol ICC’s Cool Edge is a high speed and high power card edge connector system that supports most BTB applications in electronics market.
These versatile solutions address multiple standards like PCIe, SAS, SATA, Gen 4/5, OCP 3.0, EDSFF, NGSFF/NF1, Gen Z and offer multiple BTB configurations such as mezzanine, coplanar, midplane and backplane. Moreover, the connectors are designed as Open Pin Field and are hot plug capable.[Read more]
Flash Memory Summit is the world’s largest conference discussing the trends, innovations in flash memory and its applications like smart phones, tablets, mobile and embedded systems. It will take place from 7 to 9 August 2018 at Santa Clara Convention Center, USA.[Read more]