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Tag Archives: Flash Memory Summit

AICC CONNECT: CONNECTION GUIDES

Check this blog to learn how our products are enabling the electronics revolution

Amphenol at Virtual Flash Memory Summit (FMS) 2020

Amphenol at Virtual Flash Memory Summit (FMS) 2020

Flash Memory Summit (FMS), the world’s premiere flash memory conference and exposition brings together storage designers, integrators, and IT storage professionals from around the world to create the most competitive, high-performance storage solutions. Amphenol is proud to be the part of the Virtual FMS this year, taking place from November 10th to 12th 2020.

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Meet Us at Flash Memory Summit 2019

Meet Us at Flash Memory Summit 2019

Flash Memory Summit is one of the greatest platforms for all industries associated with flash memory and its applications. This year, the event will take place at Santa Clara Convention Center, CA from 6th to 8th of August 2019.  The Summit theme this year includes Flash Memory Based Architectures, PCIe/NVMe, SSDs Solid State Drives (SSDs), Enterprise Applications and Storage, Controllers, persistent memory, new non-volatile memory technologies, standards, testing, and applications.

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Mini Cool Edge IO – The Ideal Solution to Transmit Next Generation High-Speed Signal to Designated Area in Your System

Mini Cool Edge IO – The Ideal Solution to Transmit Next Generation High-Speed Signal to Designated Area in Your System

The development of Big Data, IoT, 5G, and other high-end applications requires signal transmission speed to a istorical high. The most common signal transmission medium – Printed Circuit Board, has limitations in high-speed environments. Due to the natural characteristic of common PCB materials, severe signal distortion happens through signal route and form a serious barrier in system design, thus obstructing the development of high-end applications. 

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Industry Standard Connectors For Next-Generation Applications

Industry Standard Connectors For Next-Generation Applications

Different connector manufacturers within an industry develop their own electrical components for a wide range of applications. Even when product specifications remain the same, there are differences in the quality, size, shape, and materials used, thus, affecting application designs and architectures. Industry standards are defined to clear these discrepancies. These are rules and regulations made by a consortium of similar-minded industrialists to bring a unified approach to carry out severa [Read more]

Cool Edge – High Speed & High Power Card Edge

Cool Edge – High Speed & High Power Card Edge

Amphenol ICC’s Cool Edge is a high speed and high power card edge connector system that supports most BTB applications in electronics market. 

These versatile solutions address multiple standards like PCIe, SAS, SATA, Gen 4/5, OCP 3.0, EDSFF, NGSFF/NF1, Gen Z  and offer multiple BTB configurations such as mezzanine, coplanar, midplane and backplane. Moreover, the connectors are designed as Open Pin Field and are hot plug capable.

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