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Tag Archives: ExaMAX
AICC CONNECT: CONNECT WITH OUR LATEST NEWS
Check this space to learn how our products can make tomorrow’s technology
The 18th edition of electronica China will take place from 20 to 22 March 2019 at Shanghai New International Expo Centre. Amphenol ICC will be showcasing the widest selection of high-speed solutions this year. Here's a sneak peek of our show exhibits:[Read more]
Amphenol’s OverPass™ cable system offers a broad range that allow customers to efficiently take high speed signal from near the ASIC to anywhere in their system.
Amphenol’s OverPass™ cable system allows for the transfer of high-speed signals to twinax cables shortly after they are launched from the ASIC.[Read more]
Amphenol ICC’s OverPass™ cabling Interconnect solution addresses hardware designer / architect’s need for a lower loss signal transmission path from the ASIC chip site to the external IO port or pluggable module interface. The system transfers high-speed signals to twinax cables shortly after they are launched from the chip and delivers a direct link to the external port when compared to the more typical transmission through the PCB line or system card. The [Read more]
Communication and networking is an ever growing industry. The transformation from one generation to the next has been relentless. 1G technology was analog cellular, 2G used technologies like CDMA, GSM, and TDM to make the first giant leap towards digital communications. The speed concepts were reframed from Kbps to few Mbps with the introduction of 3G technologies like EVDO, HSPA, and UMTS.[Read more]
Backplane connectors are basic electrical connectors that help in connecting one PCB to other. The backplane connector adds mechanical strength and stability to the design. These can be widely classified into 3 types based on their speed.[Read more]
Here’s what’s on show from Amphenol ICC
Amphenol ICC's game changing 112Gb/s backplane interconnect technology - Paladin®, is the highlight product of the year. Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects and enables our customers to design complex systems.[Read more]