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Tag Archives: ExaMAX

AICC CONNECT: CONNECT WITH OUR LATEST NEWS

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Check out Amphenol ICC Solutions at Electronica China 2019

Check out Amphenol ICC Solutions at Electronica China 2019

The 18th edition of electronica China will take place from 20 to 22 March 2019 at Shanghai New International Expo Centre. Amphenol ICC will be showcasing the widest selection of high-speed solutions this year. Here's a sneak peek of our show exhibits:

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OverPass™ - The High Speed Solution

OverPass™ - The High Speed Solution

Amphenol’s OverPass cable system offers a broad range that allow customers to efficiently take high speed signal from near the ASIC to anywhere in their system.

Amphenol’s OverPass™ cable system allows for the transfer of high-speed signals to twinax cables shortly after they are launched from the ASIC.

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Explore Amphenol Solutions at DesignCon 2019

Explore Amphenol Solutions at DesignCon 2019

Amphenol will be showcasing the widest selection of high-speed solutions this year. Here's a sneak peek of our show exhibits:

High Speed IO Solutions

Adhering to the high-speed theme, our High Speed IO connector and cable solutions include OverPass, Mini-SAS HD, [Read more]

OverPass™ Interconnects – Your high speed , Low Loss Chip-to-Module Interconnect Solution

OverPass™ Interconnects – Your high speed , Low Loss Chip-to-Module Interconnect Solution

Amphenol ICC’s OverPass cabling Interconnect solution addresses hardware designer / architect’s need for a lower loss signal transmission path from the ASIC chip site to the external IO port or pluggable module interface.  The system transfers high-speed signals to twinax cables shortly after they are launched from the chip and delivers a direct link to the external port when compared to the more typical transmission through the PCB line or system card. The [Read more]

5G Wireless- The Faster Technology for Tomorrow

5G Wireless- The Faster Technology for Tomorrow

Communication and networking is an ever growing industry. The transformation from one generation to the next has been relentless. 1G technology was analog cellular, 2G used technologies like CDMA, GSM, and TDM to make the first giant leap towards digital communications. The speed concepts were reframed from Kbps to few Mbps with the introduction of 3G technologies like EVDO, HSPA, and UMTS. 

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Industry-Proven Backplane Connectors to Suit Your Speed Requirements

Industry-Proven Backplane Connectors to Suit Your Speed Requirements

Backplane connectors are basic electrical connectors that help in connecting one PCB to other. The backplane connector adds mechanical strength and stability to the design. These can be widely classified into 3 types based on their speed. 

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See You at DesignCon 2018

See You at DesignCon 2018

Here’s what’s on show from Amphenol ICC

Paladin®

Amphenol ICC's game changing 112Gb/s backplane interconnect technology - Paladin®, is the highlight product of the year. Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects and enables our customers to design complex systems.

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Meet Amphenol ICC at SC17 Conference - Denver

Meet Amphenol ICC at SC17 Conference - Denver

Amphenol ICC will be at the upcoming SC17 Conference in Denver from November 12th - 17th 2017.

The SC17 conference is an international show focusing on high performance computing, networking, storage and analysis.  Amphenol will be participating with the Ethernet Alliance group and will be displaying the latest high performance technology in interconnect solutions. Conference attendees are encouraged to stop by the booth to learn more about products like the OSFP conne [Read more]