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Tag Archives: Double Density Cool Edge Connectors
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The significance of super-fast storage systems is escalating with the progress in big data and IoT. The coming years are focusing on developing high capacity SSDs at a lower cost. We have earlier discussed researches and advancements happening with SSDs that are set to meet the enhanced application demands.[Read more]
DesignCon being the largest chip, board, and systems event in the industry witnesses the launch of many innovative products. Amphenol ICC will be is launching three high-speed server connectors at DesignCon 2020: Right Angle PCIe® Gen 4 CEM connectors, Gen Z 4C-HP Mini Cool Edge connectors and Double Density Cool Edge connectors.[Read more]
Three high-speed products were introduced to the Amphenol ICC product portfolio in the month of August. Double Density Cool Edge Connectors and BergStak® FX10 offers high-speed high-density board to board solutions and the microSD Express Connector uses PCI express 4.0 protocol rated up to 16Gb/s making it a high-performance memory card connector compliant to SD specification V7.1[Read more]