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Tag Archives: Double Density Cool Edge Connectors

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Check Out the Latest Server Connectors at DesignCon 2020

Check Out the Latest Server Connectors at DesignCon 2020

DesignCon being the largest chip, board, and systems event in the industry witnesses the launch of many innovative products. Amphenol ICC will be is launching three high-speed server connectors at DesignCon 2020: Right Angle PCIe® Gen 4 CEM connectors, Gen Z 4C-HP Mini Cool Edge connectors and Double Density Cool Edge connectors.

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Amphenol ICC New Products Updates – August 2019

Amphenol ICC New Products Updates – August 2019

Three high-speed products were introduced to the Amphenol ICC product portfolio in the month of August. Double Density Cool Edge Connectors and BergStak® FX10 offers high-speed high-density board to board solutions and the microSD Express Connector uses PCI express 4.0 protocol rated up to 16Gb/s making it a high-performance memory card connector compliant to SD specification V7.1

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