background-body

Tag Archives: DesignCon 2018

AICC CONNECT: CONNECT WITH OUR LATEST NEWS

Check this space to learn how our products can make tomorrow’s technology

See You at DesignCon 2018

See You at DesignCon 2018

Here’s what’s on show from Amphenol ICC

Paladin®

Amphenol ICC's game changing 112Gb/s backplane interconnect technology - Paladin®, is the highlight product of the year. Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects and enables our customers to design complex systems.

[Read more]
Lynx™ - The Fastest 4-Row Connection in a 2-Row Footprint

Lynx™ - The Fastest 4-Row Connection in a 2-Row Footprint

DesignCon 2018 is only a few days away and Amphenol ICC is all set for the big event with our latest product offerings, live demos, and technical presentations. We have presented our best interconnect solutions throughout the years, and have come up with innovations to meet your expectations this year.

[Read more]
M-Series™ 56 – Advanced Ball Grid Array (BGA) Connector for 56Gb/s NRZ, 112Gb/s PAM-4 Performance

M-Series™ 56 – Advanced Ball Grid Array (BGA) Connector for 56Gb/s NRZ, 112Gb/s PAM-4 Performance

The rapid acceleration of technology evolution can be seen in the disruptive products regularly entering the market today.  Advanced datacenters, crypto currency mining, autonomous vehicles, deep learning, and artificial intelligence applications are upending their spaces. Disruptive innovation challenges engineers to develop increasingly integrated designs with enhanced efficiency.

[Read more]
PwrBlade® Connector Family - Celebrating 20 Years of Excellence

PwrBlade® Connector Family - Celebrating 20 Years of Excellence

2018 marks the 20th anniversary of one of the most widely accepted and influential power connectors in the industry today, the PwrBlade® power connector. From its initial release, PwrBlade® was considered a game-changer for its high performance stamped and formed contacts. Since then, the PwrBlade® family has served a [Read more]

OSFP – Defining a New Standard for High-Speed Connections

OSFP – Defining a New Standard for High-Speed Connections

The emergence of large-scale data centers leads to high demand for higher signal speeds, bandwidth, and higher density connections to meet their complex designs and configurations.

Developing a standardized pattern was indispensable for the advancement of data center design and data management capabilities. Thus the Small Form Factor (SFF) committee was organized and they established a Multi-Source Agreement (MSA) which provides standards for connector manufacturers and network compon [Read more]

Cool Edge High Speed Card Edge Connectors - A Versatile Hybrid Solution

Cool Edge High Speed Card Edge Connectors - A Versatile Hybrid Solution

Amphenol ICC Cool Edge product family is a hybrid card edge solution, used in data centers and servers. Hybrid connectors are effective solutions serving both power and signal requirements as they contain both power and signal contacts. They come in various configurations to be used across several applications. 

Cool Edge product family address hi [Read more]

Amphenol's Game-Changing 112 Gb/s Backplane Interconnect Technology

Amphenol's Game-Changing 112 Gb/s Backplane Interconnect Technology

With a speed twice as much as the industry standard, Paladin’s® game-changing 112 Gb/s backplane interconnect technology sets the benchmark for signal integrity performance in backplane interconnects.

It has no stub resonance from signal contacts and demonstrates a smooth linear transmission beyond 40GHz. Paladin® has the lowest crosstalk in the market and impedance control over the entire mating range enabling customers to design complex systems th [Read more]

Amphenol – Bigger and Better at DesignCon 2018

Amphenol – Bigger and Better at DesignCon 2018

DesignCon is back for its 23rd year with exciting experiences for engineers across the globe. From January 30 - February 1, 2018, DesignCon 2018 is three jam packed days of interesting events conducted at the Santa Clara Convention Center.

Like the previous years, Amphenol is excited to be a part of this grand expo and conference. This time, we are back with the biggest 20’ x 50’ booth to showcase our latest interconnection technologies from more than 8 business units.

[Read more]