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Tag Archives: DesignCon
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DesignCon provides an unparalleled opportunity to check out the latest and most innovative products in the market. Throughout the event, you have access to more than 5,000 design engineers and other industry experts, demonstrations and presentations. In addition to Amphenol’s extensive product solutions [Read more]
DesignCon is only a week away and engineers around the world are eager to gather to discuss hot topics and new innovations in the industry. Amphenol will be showcasing the widest selection of high-speed solutions this year. Here's a sneak peek at our show exhibits:[Read more]
DesignCon being the largest chip, board, and systems event in the industry witnesses the launch of many innovative products. Amphenol ICC will be is launching three high-speed server connectors at DesignCon 2020: Right Angle PCIe® Gen 4 CEM connectors, Gen Z 4C-HP Mini Cool Edge connectors and Double Density Cool Edge connectors.[Read more]
Amphenol’s OverPass™ cable system offers a broad range that allow customers to efficiently take high speed signal from near the ASIC to anywhere in their system.
Amphenol’s OverPass™ cable system allows for the transfer of high-speed signals to twinax cables shortly after they are launched from the ASIC.[Read more]
DesignCon 2019 will offer more than 100 technical sessions, panel discussions, and tutorials spanning 15 tracks over the 3-day conference program. If you have purchased an All Access or 2-Day pass, you will be able to attend these sessions. Amphenol is proud to announce that Yifan Huang and Stephen Smith will present a technical paper titled “PCIe Gen 5 CEM Connector and Add-In Card PCB design optimizations” at DesignCon 2019.[Read more]
The DesignCon 2019 event is only a few weeks away and engineers around the world are eager to gather together to discuss hot topics and new innovations in the industry. Along with the pioneering products being shown by Amphenol, we will also present the latest offerings from Amphenol Ardent Concepts this year. Amphenol recently acquired Ardent Concepts, Inc., a leading designer and manufacturer of high performance multicoax assemblies, probes, connectors, and[Read more]
Amphenol ICC’s OSFP IO system is awarded the Electronic Products Magazine Product of the Year Award!!
It is a proud moment for Amphenol ICC as we have been awarded the Product of the Year Award in the “Interconnects” category of Electronic Products magazine. With a legacy of 43years, Electronic Products Annual awards are one of the most coveted awards in the industry. 100+ products were evaluated under 10 different categories before the winners were announced. Amphenol ICC’s OSFP Interconnect System was chosen as the best “Interconnect” product[Read more]
DesignCon is one of the most significant events for design engineers to learn more about developments in their field and to look forward to creating new solutions.
DesignCon 2019 will include a comprehensive three-day conference program with over 100 technical paper sessions, panels, and tutorials. It will span 14 tracks, bringing together about 5,000 professionals from high-speed communications and semiconductor industries.[Read more]