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Tag Archives: Cool Edge Connectors
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As the final day of the event is approaching, here is a sneak peek in our Data and Communications showcase at Electronica 2018.
Cool Edge is a high speed and high power board to board connector system addressing multiple standards like PCIe, SAS, SATA, Gen 4/5, OCP 3.0, EDSFF, NGSFF/NF1, Gen Z. It is offered in different configurations like mezzanine, coplanar, midplane and backplane, making it suitable for applications in data and communication such as S [Read more]
The countdown for one of the world’s largest and leading electronics fair has begun. Messe München will gather members, visitors, and exhibitors from the electronics industry around the globe from 13 to 16 November. Electronica opens a vast platform for experts to exchange ideas, see the latest innovations and share information with suppliers from all around the world.[Read more]
Communication and networking is an ever growing industry. The transformation from one generation to the next has been relentless. 1G technology was analog cellular, 2G used technologies like CDMA, GSM, and TDM to make the first giant leap towards digital communications. The speed concepts were reframed from Kbps to few Mbps with the introduction of 3G technologies like EVDO, HSPA, and UMTS.[Read more]
SSD form factors are constantly improving to meet the enhanced application demands. We previously discussed the earlier and existing SSD form factors like U.2, PCIe-based AIC, mSATA, mPCIe, and M.2. However, with the advancements in technology, its high time to prepare for next-generation SSDs.[Read more]
Different connector manufacturers within an industry develop their own electrical components for a wide range of applications. Even when product specifications remain the same, there are differences in the quality, size, shape, and materials used, thus, affecting application designs and architectures. Industry standards are defined to clear these discrepancies. These are rules and regulations made by a consortium of similar-minded industrialists to bring a unified approach to carry out severa [Read more]
Amphenol ICC’s Cool Edge is a high speed and high power card edge connector system that supports most BTB applications in electronics market.
These versatile solutions address multiple standards like PCIe, SAS, SATA, Gen 4/5, OCP 3.0, EDSFF, NGSFF/NF1, Gen Z and offer multiple BTB configurations such as mezzanine, coplanar, midplane and backplane. Moreover, the connectors are designed as Open Pin Field and are hot plug capable.[Read more]
Flash Memory Summit is the world’s largest conference discussing the trends, innovations in flash memory and its applications like smart phones, tablets, mobile and embedded systems. It will take place from 7 to 9 August 2018 at Santa Clara Convention Center, USA.[Read more]
Introduction of Cool Edge connectors is a revolutionary move by Amphenol ICC in data center engineering. The Cool Edge family started to expand with different pitches and higher performance with each new addition to the product series range. When the standard connectors offer a fine pitch of 0.8mm and 0.65mm, it helps in reducing the PCB footprints along with enhancing the efficiency.[Read more]