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Tag Archives: BOARD-TO-BOARD APPLICATIONS
AICC CONNECT: CONNECT WITH OUR LATEST NEWS
Check this space to learn how our products can make tomorrow’s technology
DesignCon 2018 is only a few days away and Amphenol ICC is all set for the big event with our latest product offerings, live demos, and technical presentations. We have presented our best interconnect solutions throughout the years, and have come up with innovations to meet your expectations this year.[Read more]
Many industries today are demanding high speed, high density connectors to suit a myriad of high-performance applications. When it comes to board-to-board (BTB) application, BergStak® is an offering that cannot be ignored. This BTB connector has continued to maintain its popularity and demand since its introduction. Today, advanced versions of the product make the range more comprehensive in meeting next-generation requirements.
These industry-proven connectors are know [Read more]