Enterprise SSDs offer enhanced endurance and power features to keep mission-critical environments up and running. Amphenol ICC offers an extended range of Solid State Drive (SSD) interconnect solutions based on 4th generation PCIe standards.

PCI Express® Gen 4 and Gen 5 Card Edge Connectors

Amphenol ICC’s PCIe Gen 4 and Gen 5 connectors meet industry standard PCIe 4.0 & 5.0 (proposed) requiring higher speed performance. The optimized series supports backward mating and is footprint compatible with PCIe 3/2/1. This 1.00mm pitch, vertical card edge connector provides support for 16Gb/s (Gen 4), to 32Gb/s per differential signal pair.

Cool Edge 1.00mm PCIe Connectors

Cool Edge PCIe connectors also bring high-speed PCIe support into a one-piece card edge package with 16GT/s Gen 4 and 32GT/s Gen 5 capabilities. Slim connector design saves space on the motherboard while facilitating other higher density applications. 


This 0.6mm pitch connector is designed for high-speed and high-density differential or single-ended signaling board-to-board applications. Lynx connectors provide double density with four rows in the space of two and provide data rates up to 25Gb/s.

Lynx QD

Lynx QD offers you an innovative, high-performance solution in 20, 40, 60 and 80 position module sizes for applications that demand high signal density and board real estate constraints. This innovative interconnect solution supports data rates of 56Gb/s PAM4 and provides a 4-Row differential signaling structure in a compact 2-Row footprint.

M-Series 56

M-Series 56 is an advanced Ball Grid Array (BGA) connector supporting board-to-board or flex assembly architectures. Its next-generation differential pair contacts are designed for 56Gb/s NRZ and 112Gb/s PAM-4 performance. 


With 1mm to 5mm housing heights and data rates up to 25Gb/s, with future technology roadmap up to 50+Gb/s, Amphenol ICC’s cStack high speed solder-less interconnect solution provides excellent performance in a low profile footprint.


The MEG-Array® Mezzanine Connector is a high density, high speed, discrete contact, array connector in the revolutionary BGA platform. 1.27mm x 1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 28Gb/s.

Visit our website to learn more about these products and other innovative offerings from Amphenol ICC.