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Amphenol ICC’s Data & Communications Product Lines on Final Day of Electronica 2018
As the final day of the event is approaching, here is a sneak peek in our Data and Communications showcase at Electronica 2018.
Cool Edge is a high speed and high power board to board connector system addressing multiple standards like PCIe, SAS, SATA, Gen 4/5, OCP 3.0, EDSFF, NGSFF/NF1, Gen Z. It is offered in different configurations like mezzanine, coplanar, midplane and backplane, making it suitable for applications in data and communication such as Solid State Drive, NVMe SSD, enterprise data center, Network Interface Card and Add-In Card.
High-Speed Input Output Connectors
Amphenol ICC exhibits a wide range of high-speed input-output connectors this year in Electronica. QSFP DD, OSFP, and QSFP 100G are just a few to be named. The high-speed QSFP DD interface comprises of a 76-position, 0.8mm pitch connector built for use in high-speed serial applications. These connectors enable up to 14.4 Tb/s aggregate bandwidth in a single switch slot and are backward mating compatible with QSFP. The Octal SFP Interface (OSFP) is optimized for signal integrity performance With a 0.6mm contact pitch, 4 rows of contacts and a horizontal port pitch of 23.38mm.
Amphenol ICC Paladin® is a revolutionary product with 112Gb/s backplane interconnects technology that allows designing complex architectures to support present-day data rates, with headroom for next-generation performance requirements. It also offers the broadest product platform in the industry, supporting traditional backplanes, cable backplanes, over 100 potential direct orthogonal configurations, and much more.
Visit us at Hall C2, Booth 147 today to connect with our experts, get inspired by our exhibits at Messe München, before the show ends.