March 2018 is a busy month where Amphenol ICC will showcase its game changing products and technologies in several major events.  Join us at the following events:


The first week of March marks the start of APEC 2018, the premier event in applied power electronics. APEC focuses on the practical and applied aspects of the power electronics business; bringing together thousands of industry experts, engineers, and students to share and collaborate on new power technologies.

This year, Amphenol ICC will be showcasing its key power solutions, such as products in the BarKlip®, PwrBlade®, PwrMAX®, and CoolPower® product families, along with much more!  The Power Solutions team will also be giving a LIVE power demonstration during the event, which will measure end of life resistance in real time - giving viewers the opportunity to see our proprietary design elements that lower voltage drop and increase overall efficiency.

Please be sure to visit our booth at Henry B. Gonzalez Convention Centre from 4 to 8 March 2018 to learn more about the world leader in power solutions.

Optical Fiber Communication (OFC) Conference and Exhibition

With a legacy of over 40 years, OFC is the largest global conference and exhibition for optical communications and networking professionals. OFC is a platform to learn about the advancements in technology and explore the opportunities of tomorrow. Amphenol ICC will present its fastest, compact, cost and power efficient 300Gb/s Leap® On-Board Transceiver.

Visit us at San Diego Convention Center from 11 to 15 March 2018 to learn more.

Electronica China

Electronica China is one of the leading international trade shows for electronics in Asia. The 17th edition of this key trade show will take place from 14 to 16 March 2018 at Shanghai New International Expo Centre. The exhibition brings a comprehensive range of latest developments in the industry from across the globe.

Amphenol ICC is a leading participant of electronics china 2018, showcasing a wide range of product series including the suite of High Speed Backplane, High Speed IO, D-Subminiature and Modular Jacks along with NETBridge™ Automotive Ethernet Connectors and Mini Cool Edge 0.60mm.


Open Compute Project - US Summit 

The 2018 OCP US Summit is 2 jam packed days for over 3000 engineers, executives, developers and suppliers around the globe sharing knowledge, looking together to future developments and supporting each other to grow. The annual summit will be held on 20 to 21 March at the San Jose Convention Center.

Open Compute Project wins by Amphenol ICC like BergStak+™ 0.80mm and BarKlip® IO will be featured in the summit.

Watch this space for more updates on these events.