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Monthly Archives: September 2019
AICC CONNECT: CONNECT WITH OUR LATEST NEWS
Check this space to learn how our products can make tomorrow’s technology
Virtual Reality (VR) like the term suggests, creates a virtual atmosphere similar to the real world where you can interact with virtual objects. This is made possible with VR devices like headsets which create a 3D experience with standardized hardware and software support.[Read more]
Three high-speed products were introduced to the Amphenol ICC product portfolio in the month of August. Double Density Cool Edge Connectors and BergStak® FX10 offers high-speed high-density board to board solutions and the microSD Express Connector uses PCI express 4.0 protocol rated up to 16Gb/s making it a high-performance memory card connector compliant to SD specification V7.1[Read more]
Traditional Data Centers are giving way to private and public cloud/fog. Data Center storage using NAND flash has gained an upper hand over traditional spinning media. With falling flash prices, there is an increased uptake of All-Flash Storage Arrays composed of faster and denser SSDs.[Read more]