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Monthly Archives: December 2017
AICC CONNECT: CONNECT WITH OUR LATEST NEWS
Check this space to learn how our products can make tomorrow’s technology
Amphenol ICC Cool Edge product family is a hybrid card edge solution, used in data centers and servers. Hybrid connectors are effective solutions serving both power and signal requirements as they contain both power and signal contacts. They come in various configurations to be used across several applications.[Read more]
With a speed twice as much as the industry standard, Paladin’s® game-changing 112 Gb/s backplane interconnect technology sets the benchmark for signal integrity performance in backplane interconnects.
It has no stub resonance from signal contacts and demonstrates a smooth linear transmission beyond 40GHz.[Read more]
DesignCon is back for its 23rd year with exciting experiences for engineers across the globe. From January 30 - February 1, 2018, DesignCon 2018 is three jam packed days of interesting events conducted at the Santa Clara Convention Center.
Like the previous years, Amphenol is excited to be a part of this grand expo and conference. This time, we are back with the biggest 20’ x 50’ booth to showcase our latest interconnection technologies from more than 8 business units.[Read more]
Many industries today are demanding high speed, high density connectors to suit a myriad of high-performance applications. When it comes to board-to-board (BTB) application, BergStak® is an offering that cannot be ignored. This BTB connector has continued to maintain its popularity and demand since its introduction. Today, advanced versions of the product make the range more comprehensive in meeting next-generation requirements.[Read more]
Plating technology defines the mating cycles, durability and performance of connectors. GXT®, AGT®, and GCS® are innovative plating solutions that create durable, reliable, and economical connectors with increased efficiency.
GXT® plating, a mix of palladium-nickel with gold flash was developed back in the 1980s.[Read more]