With a speed twice as much as the industry standard, Paladin’s® game-changing 112 Gb/s backplane interconnect technology sets the benchmark for signal integrity performance in backplane interconnects.

It has no stub resonance from signal contacts and demonstrates a smooth linear transmission beyond 40GHz. Paladin® has the lowest crosstalk in the market and impedance control over the entire mating range enabling customers to design complex systems that support today's data rates with room for tomorrow's performance requirements. With a simplified connector construction of discretely shielded and balanced differential pairs it is designed for ultimate scalability and flexibility.

Paladin® has the broadest product platform supporting all system architectures from traditional backplane, cable, co-planar and mezzanine orientations up to 49 different direct orthogonal configurations.

Amphenol ICC has often introduced revolutionary products to the industry, among which Paladin® is the latest and the most innovative.

For more information, click here. Mark your calendar to visit our booth #833 at DesignCon to see our product and live demo first hand.

Watch this space to know more about our other products on DesignCon 2018.