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Amphenol – Bigger And Better At Designcon 2018
DesignCon is back for its 23rd year with exciting experiences for engineers across the globe. From January 30 - February 1, 2018, DesignCon 2018 is three jam packed days of interesting events conducted at the Santa Clara Convention Center.
Like the previous years, Amphenol is excited to be a part of this grand expo and conference. This time, we are back with the biggest 20’ x 50’ booth to showcase our latest interconnection technologies from more than 8 business units.
Some of the key products and demonstrations we will be highlighting this year include Paladin®, OSFP & QSFP DD ,QSFP, PwrBlade®, High Speed FPC, Lynx, and Mini Cool Edge. We are also having a technical session with IBM on PCIe Connector and Interface Development for 25-32Gb/s Channel Bandwidth. Engineers can find out how Amphenol develops ultra high speed solutions in the tiniest form factor.
Visit us at booth #833 to see how Amphenol’s new products are “Enabling the Electronics Revolution” and watch this space for more updates!