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AICC CONNECT: CONNECT WITH OUR LATEST NEWS
Check this space to learn how our products can make tomorrow’s technology
Minitek® Pwr continues to be one of the most popular connectors that offer compact and flexible medium to high-power solutions. Fully-polarized, scoop-proof housings and a low insertion force add to the durability of these connectors, and features like Blind Mate Interface (BMI) option enhances its usability.
Amphenol ICC’s Minitek® Pwr connectors support wire-to-board and w [Read more]
The number of times a connector can connect and disconnect with its counterpart while meeting all its specifications is termed as “mating cycles”. The mating cycle of a connector helps to estimate the life span of a connector in a particular application.
For instance, while the mating cycle for a USB connector will be in thousands, a FFC / FPC connector will withstand only tens of cycles. This is because a USB connector is regularly connected and disconnected.[Read more]
You often hear, “think outside the box to find innovative solutions.” At Amphenol ICC, we would like you to think “Inside the Box;” with InfinX®. With this proven solution, you can solve critical design challenges and innovate within your current applications.
Amphenol ICC’s InfinX® is designed to meet the needs of 25+Gb/s applications. Available in 4- and 6-Pair configurations, InfinX® is the best [Read more]
Major OEM and component manufacturers including Amphenol ICC are collaborating to help data center designers shed their proprietary outlook and go open source.
Open Compute Alliance
A consortium known as the Open Compute Project Foundation (OCP) endorses and publicly releases data center designs from its member OEMs like Facebook and Microsoft. These designs can be utilized by every other aspiring vendor to their clients’ benefit.   [Read more]
With a 2.00mm pitch, Minitek® is compatible with all types of connections between cables, wires, and PCBs. This design has helped to save up to 38% space compared with the conventional 2.54mm design.
Minitek® product range is so extensive and modular that it can be used for all types of wire-to-board, board-to-board, and cable-to-board interconnections on this pitch size.[Read more]
Memory standards have always been a factor determining the performance of a system. Over time, it has gone through constant updates from SDR, or Single Data Rate RAM to the recent DDR or Double Data Rate.
The shift to SRAM and DDR went through constant updates to meet the demand of ultra-modern innovations in a fast pace.[Read more]
Advanced electronic applications are in constant need of next-generation chip-to-board, flex-to-board, and board-to-board interconnection technology. From applications that require improved thermal performance and high-speed performance to latest semiconductors, various technologies trust the integrated design features of the cLGA packages.[Read more]