Part Specification Detail
The information below is for reference only. For more technical details, refer to product specification and application specification.
Product Compliance/Standards
PCIe Gen 2 Compatible, For mating height:5~12mm PCIe Gen 3 Compatible
Height above Board
7.70mm (0.303in)
Height Mated
9.00mm (0.354in) | 10.00mm (0.394in) | 11.00mm (0.433in) | 12.00mm (0.472in)
Current Rating
0.80A per contact
Resistance (Contact)
30mΩ max. (Initial), 50mΩ max. (After Test)
Resistance (Insulation)
1000MΩ min (Initial), 100MΩ min (After Test)
Durability (Mating cycles)
100 Mating Cycles
Material Contact
Nickel Copper
Material Housing
Glass Filled LCP
Operating Temperature Range
-40°C to +125°C
Plating Contact Area
0.065μm (2.559μin) Gold Flash over 0.69μm (27.165μin) Palladium-Nickel
Tail Plating
2.00μm (78.740μin) Tin
Locating Pegs
Locating Pegs
Solder process
Compatible with Vapor Phase|IR Reflow soldering processes
Packaging
Tape and Reel with Metal Cap
The information below is for reference only. For more technical details, refer to product specification and application specification.