Notebook Computers

Modern computing is introducing consumers to the world of novel and inventive technologies. Today's users demand lighter, faster and higher quality machines with enhanced processing power. It is this demand for smaller and sleeker devices that drive the ever-inventive Notebook market. The lightweight notebooks are thinner and portable with an impressive array of CPU, GPU, and RAM chips stitched into a fabric of slender boards and flex circuits. Amphenol provides a range of connectors suiting the battery management, trackpad, high def cameras, USB4 connectors and storage drives of powerful Notebooks fueling the future of next generation consumer ownership.

Notebook Computers

USB 4 Gen 3 Type C
  • MULTI-PROTOCOL, HIGH SPEED USB SOLUTION FOR NEXT GENERATION DESIGNS USB 4 connectors compatible...
USB 3.1 GEN 2
  • COMPLIANT TO USB 3.1 SPECIFICATIONS; IDEAL FOR SERVER APPLICATIONS Amphenol USB 3.1 Gen 2...
USB Type C
  • SCALABLE, SUPERSPEED CONNECTOR SYSTEM USB Type C connectors are expected to be widely used as a...
USB 3.1 GEN 1 Connector
  • 5GB/S OPTIMIZED CONSUMER INTERFACE FCI Basics USB 3.1 Gen 1 SuperSpeed connector delivers 10x the...
USB 2.0 Connector
  • 0.5GB/S CONSUMER INTERFACE FCI Basics USB 2.0 connector delivers a data rate of up to 480Mb/s. The...
BergStak® 0.40mm ...
  • USCAR-2 COMPLIANT CONNECTORS WITH SELF-ALIGNING FEATURE FCI Basics BergStak® 0.40mm...
0.35mm Micro Board-to-Board...
  • HIGH DENSITY MICRO BOARD-TO-BOARD Amphenol's 101 series are 0.35mm pitch micro board-to-board...
BergStak® 0.50mm ...
  • FINE PITCH SOLUTION WITH SELF-ALIGNMENT FEATURE FCI Basics BergStak® 0.50mm self-alignment...
BergStak® 0.80mm Pitch
  • FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FCI Basics BergStak® 0.8mm is a flexible...
BergStak® FX10 0.50mm ...
  • HIGH SPEED HIGH DENSITY MINIATURE CONNECTOR FCI Basics BergStak® product range is expanded to...
PCIe® M.2 Gen 3 and Gen 4 ...
  • HIGH DENSITY HIGH PERFORMANCE CONNECTOR Amphenol's PCIe® M.2 Gen 3 and Gen 4 connectors...
PCIe® M.2 Gen 5 Card Edge ...
  • HIGH DENSITY HIGH PERFORMANCE CONNECTOR Amphenol's PCIe® M.2 Gen 5 Connectors provide 67...
HDMI Connectors
  • HIGH SPEED CONSUMER AUDIO AND VIDEO INTERFACE FCI Basics HDMI™ (High-Definition Multimedia...
DisplayPort
  • HIGH PERFORMANCE DIGITAL AUDIO/VIDEO INTERCONNECT SOLUTION Amphenol DisplayPort connector system...
Modular Jack - RJ45
  • FCI Basics Modular Jacks include single and multi-port solutions that are widely used in Telecom,...
D-Sub Standard Density...
  • STANDARD DENSITY D-SUBMINIATURE CONNECTORS Current rating for stamped and formed signal pin is...
Miniature Jack Connector
  • Amphenol's 3.5mm diameter miniature jack connector is a family of connectors used for analog...
0.50mm FFC/FPC Connectors...
  • RIGHT ANGLE NON-ZIF FLEX AUTOLOCK CONNECTORS F308/F332 series is a 0.50mm pitch right angle...
0.40mm pitch Flex Connectors
  • A ZIF FLEX SOLUTION WITH BACK FLIP RETENTION FOR MINIATURE APPLICATIONS FCI Basics 0.40mm pitch...
0.50mm FFC/FPC Connectors
  • MULTI-HEIGHT VIBRATION-PROOF FLEX CONNECTOR Amphenol's 0.50mm pitch flex connectors utilize...
1.00mm FFC/FPC Connectors
  • MULTI-HEIGHT VIBRATION-PROOF FLEX CONNECTOR Amphenol's 1.00mm pitch flex connectors utilize...
0.21mm pitch Flex Connectors
  • A LIF FLEX SOLUTION WITH ULTRA-FINE PITCH FOR MINIATURE APPLICATIONS FCI Basics 0.21mm pitch flex...
0.30mm pitch Flex Connectors
  • A ZIF FLEX SOLUTION WITH FRONT FLIP RETENTION FOR MINIATURE APPLICATIONS FCI Basics 0.30mm pitch...
High-Speed Flex Connectors
  • 0.3MM PITCH HIGH SPEED, LOW PROFILE FLEX SOLUTION FOR MINIATURE APPLICATIONS FCI Basics High-Speed...
DDR5 SO-DIMM Connectors
  • HIGH SPEED HIGH DENSITY SO-DIMM SOCKETS DDR5 SO-DIMM connectors deliver high-speed and bandwidth....
DDR5 Memory Module Sockets...
  • COMPLIES TO NEW INTERFACE STANDARD JEDEC SO-023 Vertical DDR5 DIMM sockets from Amphenol provide...
DDR4 Ultra Low Profile Memory...
  • HIGH SPEED DIMM MODULE CONNECTOR FOR LOW PROFILE SYSTEM DDR4 Ultra Low Profile (ULP) vertical DIMM...
DDR4 SO-DIMM Memory Module...
  • HIGH SPEED HIGH DENSITY SO-DIMM SOCKETS DDR4 SO-DIMM connectors deliver high-speed and bandwidth....
DDR4 Memory Module Sockets
  • NEXT-GENERATION HIGH SPEED DIMM MODULE CONNECTOR Vertical DDR4 DIMM sockets from Amphenol provide...
DDR3 Memory Module Sockets
  • POPULAR HIGH SPEED DIMM MODULE CONNECTOR DDR3 vertical DIMM sockets are designed to accept 240...
DDR2 SO-DIMM Memory Module...
  • SMALL FORM FACTOR MULTI-VOLTAGE DIMM MODULE CONNECTOR DDR2 SO-DIMM sockets are designed to accept...
Minitek® 0.80mm Wire-to-Board ...
  • MODULAR AND FINE PITCH WIRE-TO-BOARD SOLUTION Designed for finest pitch wire-to-board...
Minitek® 1.00mm Wire-to-Board ...
  • MODULAR AND FINE PITCH WIRE-TO-BOARD SOLUTION FCI Basics Minitek® 1.00mm connector system is...
Minitek® 1.50mm Wire-to-Board ...
  • MODULAR AND COMPACT WIRE-TO-BOARD SOLUTION FCI Basics Minitek®1.50mm connector system is the...
Minitek127® 1.27mm ...
  • MODULAR RANGE OF WIRE/CABLE-TO-BOARD CONNECTORS FCI Basics Minitek127® 1.27mm connector...
1.25mm Wire-to-Board...
  • HIGH QUALITY AND COMPACT WIRE-TO-BOARD SOLUTION FCI Basics 1.25mm wire-to-board connector system...
1.20mm Wire-to-Board...
  • LOW PROFILE AND COMPACT WIRE-TO-BOARD SOLUTION FCI Basics 1.20mm wire-to board-connector system...
Minitek® Multipitch 1.25mm ...
  • MODULAR, RELIABLE, AND COMPACT SOLUTION FCI Basics Minitek® Multipitch 1.25mm Wire-to-Board...
Minitek® 2.00mm - ...
  • Minitek® is FCI Basics brand for board to board and wire/cable to board connectors in 2.00mm...
Filter
Filter
Plating Contact Area
  1. 0.025μm (1μin) Gold 1 item
  2. 0.05μm (2μin) Gold 2 items
  3. 0.05μm (2μin) Gold, with Nickel underplating 1 item
  4. 0.05μm (2μin) GXT 1 item
  5. 0.065μm (2.6μin) Gold Flash over 0.69μm (27μin) Palladium-Nickel 1 item
  6. 0.076μm (3μin) Gold 3 items
  7. 0.08μm Gold min, 1.27 to 4.00μm Nickel underplating over all 2 items
  8. 0.1μm Gold min, 2.0 to 7.60μm Nickel underplating over all 1 item
  9. 0.102μm (4μin) Gold 1 item
  10. 0.127μm (5μin) Gold 1 item
  11. 0.127μm (5μin) Gold with High Performance Lubricant 1 item
  12. 0.127μm (5μin) Gold with High Performance Lubricant/0.76μm (30μin) Gold 1 item
  13. 0.15μm (6μin) GXT 1 item
  14. 0.2μm (8μin) Gold with Nickel underplating 1 item
  15. 0.2μm (8μin) Gold with Palladium Nickel underplating 1 item
  16. 0.20μm (7.874μin) Gold / 0.05μm (1.968μin) Gold 1 item
  17. 0.20μm (7.874μin) Gold / 2.00μm (78.740μin) Tin 1 item
  18. 0.20μm (8μin) Gold 2 items
  19. 0.20μm (8μin) Gold/Tin 1 item
  20. 0.25μm (10μin) Gold 2 items
  21. 0.30μm (12μin) Gold 1 item
  22. 0.38 1 item
  23. 0.38μm (15μin) Gold 11 items
  24. 0.38μm (15μin) Gold over Nickel 1 item
  25. 0.38μm (15μin) GXT 1 item
  26. 0.45μm (18μin) Gold 1 item
  27. 0.76 2 items
  28. 0.76µm (30µin) Gold with Nickel underplating 1 item
  29. 0.76μm (29.921μin) Palladium Nickel with 0.10μm(3.937μin) Gold Flash 1 item
  30. 0.76μm (30μin) Gold 17 items
  31. 0.76μm (30μin) GXT 5 items
  32. 0.76μm (30μin) Selective Gold 1 item
  33. 0.76μm (30μin.) Gold over 1.27μm (50μin.) Nickel 1 item
  34. 1.27μm (50μin) Gold 1 item
  35. 1.27μm (50μin) GXT 1 item
  36. 1.27μm (50.000μin) GXT 1 item
  37. 2μin Gold plating at contact area, 40 to 120μin Nickel underplating over all 1 item
  38. 2μin Min Gold plating at contact area, 50μin Nickel underplating over all 1 item
  39. 3μin Gold plating at contact area, 40 to 120μin Nickel underplating over all 2 items
  40. 80 to 200μin Matte Tin plating over all, 40 to 120μin Nickel underplating over all 2 items
  41. Au flash over Ni under plating 1 item
  42. Flash Gold 1 item
  43. Gold Flash 11 items
  44. Gold Plating 1 item
  45. Matte Tin 1 item
  46. N/A 3 items
  47. Tin 3 items
  48. Tin (preplated) 1 item
Cable Insertion Type
  1. Non-ZIF 3 items
  2. ZIF 5 items
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