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Plating Contact Area
  1. 0.05μm (2μin) Gold 2 items
  2. 0.05μm (2μin) Gold, with Nickel underplating 1 item
  3. 0.065μm (2.6μin) Gold Flash over 0.69μm (27μin) Palladium-Nickel 1 item
  4. 0.2μm (8μin) Gold with Nickel underplating 1 item
  5. 0.2μm (8μin) Gold with Palladium Nickel underplating 1 item
  6. 0.20μm (7.874μin) Gold / 0.05μm (1.968μin) Gold 1 item
  7. 0.20μm (7.874μin) Gold / 2.00μm (78.740μin) Tin 1 item
  8. 0.20μm (8μin) Gold 2 items
  9. 0.20μm (8μin) Gold/Tin 1 item
  10. 0.20μm (8μin) GXT 1 item
  11. 0.25μm (10μin) Gold 2 items
  12. 0.38μm (14.960μin) GXT over 0.76μm (30μinch) Nickel 1 item
  13. 0.38μm (15μin) Gold 4 items
  14. 0.38μm (15μin) Gold over 0.76μm (30μin) Nickel 1 item
  15. 0.38μm (15μin) GXT 3 items
  16. 0.76 1 item
  17. 0.76µm (30µin) Gold with Nickel underplating 1 item
  18. 0.76μm (29.921μin) GXT over 0.76μm (29.921μin) Nickel 1 item
  19. 0.76μm (29.921μin) Palladium Nickel 1 item
  20. 0.76μm (29.921μin) Palladium Nickel with 0.10μm(3.937μin) Gold Flash 1 item
  21. 0.76μm (29.921μin) Selective Gold 1 item
  22. 0.76μm (30μin) Gold 4 items
  23. 0.76μm (30μin) GXT 3 items
  24. 1.27μm (50.000μin) Gold Special 1 item
  25. 1.27μm (50.000μin) GXT Special 1 item
  26. 2μin Gold plating at contact area, 40 to 120μin Nickel underplating over all 1 item
  27. 2.00μm (78.740μin) Tin 1 item
  28. 2.00-5.00μm(78.740μin-196.850μin) Tin 1 item
  29. 2.00-6.00 μm (78.740-236.220 μin) Tin 1 item
  30. 2.00-6.00μm (78.740-236.220μin) Matte Tin 1 item
  31. 2.00-6.00μm (78.740-236.220μin) Tin 1 item
  32. 2.00-6.00μm(78.740-236.220μin) Matte Tin 1 item
  33. 2.54μm (100μin) Tin 1 item
  34. 3.81μm (150μin) Tin 1 item
  35. Gold Flash 3 items
  36. N/A 1 item
  37. Telecom Plating Option that meets Telcordia GR-1217-CORE and NPS25298-2 Specifications 1 item
  38. Tin 1 item
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  1. FLTStack 0.50mm Floating Board-to-Board Connector
    FLTStack 0.50mm Floating Board-to-Board Connector
    XY-AXIS-FLOATING WITH SELFALIGNMENT, AND COMPLIANT WITH USCAR-2 FLTStack 0.50mm is a floating type Board-to-Board... DETAILS
  2. BergStak® FX10 0.50mm Board-to-Board Connector
    BergStak® FX10 0.50mm Board-to-Board Connector
    HIGH SPEED HIGH DENSITY MINIATURE CONNECTOR FCI Basics BergStak® product range is expanded to include... DETAILS
  3. 0.80mm Floating Board-to-Board Connectors - B406/B407/B410 Series
    0.80mm Floating Board-to-Board Connectors - B406/B407/B410 Series
    HIGH SPEED BOARD-TO-BOARD WITH FLOATING MECHANISM Amphenol's B406/B407/B410 series are 0.80mm pitch... DETAILS
  4. BergStak® 0.50mm Self-Alignment Board-to-Board Connector
    BergStak® 0.50mm Self-Alignment Board-to-Board Connector
    FINE PITCH SOLUTION WITH SELF-ALIGNMENT FEATURE FCI Basics BergStak® 0.50mm self-alignment connectors... DETAILS
  5. BergStak® 0.40mm Self-Alignment Board-to-Board Connector
    BergStak® 0.40mm Self-Alignment Board-to-Board Connector
    USCAR-2 COMPLIANT CONNECTORS WITH SELF-ALIGNING FEATURE FCI Basics BergStak® 0.40mm self-alignment... DETAILS
  6. Minitek127® 1.27mm Board-to-Board
    Minitek127® 1.27mm Board-to-Board
    FCI Basics Minitek127® standard board-to-board connector is the improved 1.27mm pitch modular system.... DETAILS
  7. BergStak® 0.80mm Pitch
    BergStak® 0.80mm Pitch
    FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FCI Basics BergStak® 0.8mm is a flexible solution... DETAILS
  8. MEG-Array® R+
    MEG-Array® R+
    56GB/S HIGH SPEED MEZZANINE BGA CONNECTOR SYSTEM Leveraging proven technologies, including an industry... DETAILS
  9. MEG-ARRAY
    MEG-Array®
    INDUSTRY-PROVEN BGA ARRAY CONNECTOR The MEG-Array ® Mezzanine Connector system provides the high... DETAILS
  10. BergStik® 2.54mm
    BergStik® 2.54mm
    GENERAL PURPOSE VERSATILE STACKERS WITH BREAKAWAY DESIGN BergStik® FCI Basics 2.54mm unshrouded... DETAILS
  11. Minitek® 2.00mm
    Minitek® 2.00mm
    SPACE-SAVING BOARD / CABLE-TO-BOARD HEADERS AND RECEPTACLES Minitek® is Amphenol ICC's brand... DETAILS
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