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Overview

Overview

Features
  • DIMM connectors feature a low insertion-force socket design that requires less than 24 pounds force for module installation
  • Contact design protects against stubbing and supports high-speed serial differential signaling at data rates extending to 4.8Gb/s for DDR3
  • Low Level Contact Resistance (LLCR) featured on DDR3 sockets accept RDIMM DDR3 modules
  • Slim latch and connector body designs facilitate optimized airflow
Benefits
  • Connectors provide mechanical voltage keying and end latches for module retention and ejection
  • Available solder tail options for vertical DDR3 connectors support use on 1.58mm (.062in.) or 2.36mm (.093in.) thick motherboards, while press-fit options extend use to thicker motherboards
  • RoHS-Compliant and "Lead-free" process-compatible options are available to aid compliance with lead
  • VLP form factors provide connector heights or less than 21mm above the board, while accepting modules with a seating height of less than 2.4mm
Target Market / Application
Data
  • Server communications
  • Routers
  • Switches
  • Base Stations
Industrial & Instrumentation
  • Industrial
  • Embedded systems
Documentation
Configure Your Product

Configure Your Product

Configure your Amphenol FCI product by using our Part Configurator below. To download the 3D model and 2D drawing and to generate a datasheet, please login.

Configure product not available for this product series.

Part Numbers

Part Numbers

Filter
Color - Housing
  1. Black 32 items
  2. Blue 2 items
  3. Ivory 3 items
Height above Board
  1. 20.55mm (0.8090inch) 5 items
  2. 21.33mm (0.84inch) 3 items
  3. 21.5mm(0.85in) 6 items
  4. 23.1mm (0.909inch) 15 items
  5. 32.2mm (1.268inch) 2 items
  6. 50.6mm (0.8110inch) 4 items
Hold Down
  1. Metal Clips 21 items
  2. None 16 items
Length (Peg)
  1. 2.60mm 6 items
  2. 4.30mm 7 items
  3. 4.50mm 3 items
Locating Pegs
  1. 1 peg 9 items
  2. 3 pegs 7 items
  3. No 21 items
Plating Contact area
  1. 0.076μm (3μinch) Gold 4 items
  2. 0.25μm (10μinch) Gold 1 item
  3. 0.38μm (15μinch) Gold 12 items
  4. 0.76μm (30μinch) Gold 20 items
Retention Feature
  1. Yes 21 items
Solder process
  1. IR|Wave|Vapor phase 4 items
  2. Wave 24 items
Termination Style
  1. Board Through Mount 33 items
  2. Surface Mount 4 items
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Grouped product items
Part Number Description Product Drawing Status
DDR3

Vertical Through Mount 240 Position DDR3 DIMM Connector, 1mm (0.039inch) Centerline with Row-to-Row tail spacing of 1.9mm (0.075inch)

Product Drawing Check Stock
DDR3

Vertical Through Mount 240 Position DDR3 DIMM Connector, 1mm (0.039inch) Centerline with Row-to-Row tail spacing of 1.9mm (0.075inch)

Product Drawing Check Stock
DDR3

Vertical Through Mount 240 Position DDR3 DIMM Connector, 1mm (0.039inch) Centerline with Row-to-Row tail spacing of 1.9mm (0.075inch)

Product Drawing Check Stock
DDR3

Vertical Through Mount 240 Position DDR3 DIMM Connector, 1mm (0.039inch) Centerline with Row-to-Row tail spacing of 1.9mm (0.075inch)

Product Drawing Check Stock
DDR3

Vertical Through Mount 240 Position DDR3 DIMM Connector, 1mm (0.039inch) Centerline with Row-to-Row tail spacing of 1.9mm (0.075inch)

Product Drawing Check Stock
DDR3

Vertical Through Mount 240 Position DDR3 DIMM Connector, 1mm (0.039inch) Centerline with Row-to-Row tail spacing of 1.9mm (0.075inch)

Product Drawing Check Stock
DDR3

Vertical Through Mount 240 Position DDR3 DIMM Connector, 1mm (0.039inch) Centerline with Row-to-Row tail spacing of 1.9mm (0.075inch)

Product Drawing Check Stock
DDR3

Horizontal 240 Position DDR3 SMTDIMM Connector, 1.0mm (0.0394inch) Staggered Centerline spacing

Product Drawing
active_on_hold
Status active on hold
Check Stock
DDR3

Horizontal 240 Position DDR3 SMTDIMM Connector, 1.0mm (0.0394inch) Staggered Centerline spacing

Product Drawing
active_on_hold
Status active on hold
Check Stock
DDR3

DDR3 240 Position Socket Press Fit VLP (for RDIMM Module)

Product Drawing
obsolete
Status obsolete
Check Stock
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Test Report

Test Report

Kindly contact Amphenol FCI for test report.

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